Thanks to their high scalability, the new conga-IC170 Thin Mini-ITX boards are ideal for a wide variety of industrial applications. These range from airless HMIs, control and SCADA systems, powerful and robust kiosk and retail systems, slot machines, and digital signage. Due to their slim design, with a height of only 20 millimeters, they are also suitable for industrial all-in-one designs and extremely thin panels. The optional Smart Battery support expands the range of deployments to include even battery-powered portable applications, such as portable ultrasound equipment for healthcare technology. The integrated board management controller and support for Intel® Pro™ technology with Intel® Active Management Technology (Intel® AMT) increase the reliability of distributed IoT system installations and, in many cases, eliminate the need for on-site maintenance.
The feature set in detail:
The conga-IC170 Thin Mini-ITX motherboards are equipped with dual-core U-series versions of Intel® Core™ processors from the 6th generation. Scalability starts with the entry-level 2.0 GHz Intel® Celeron® 3995U processor and then ranges from the Intel® Core™ i3 6100U (2.3 GHz) and i5 6300U (2.4 GHz, 3 GHz turbo) processors, up to the Intel® Core™ i7 6600 with a maximum turbo clock speed of 3.4 GHz. Depending on the processor variant, the new motherboards offer a configurable TDP from 7.5 to 15 watts, making it easy to align with the application's power requirements. With two SO-DIMM slots, the motherboards support up to 32GB of DDR4-2133 memory, providing significantly more bandwidth and better energy efficiency than traditional DDR3 implementations. The integrated Intel® Gen9 graphics support DirectX 12 and OpenGL 4.4 for high-performance 3D graphics on up to three independent 4K displays at 60Hz (3840 x 1260) via two DP++ and one eDP ports, with the option to configure a dual-channel 24-bit LVDS interface. It also supports HEVC, VP8, VP9, and VDENC video encoding and decoding.
In addition to four PCIe (Gen 3) slots, the comprehensive interface package also includes one mPCIe slot and an M.2 connector for expansion or an SSD. Four USB 3.0 and six USB 2.0 ports are available for connecting additional peripherals; two Gigabit Ethernet ports and a SIM card slot provide M2M and IoT connectivity; and a MIPI CSI-2 interface enables direct connection of low-cost CMOS cameras. Other industrial interfaces include two COM ports, one of which can be configured for ccTalk, and eight GPIO pins. An integrated secure platform module is offered as an option. Hard drives and SSDs can be connected via two SATA 3.0 ports, and 5.1 HD digital audio is also available. All current Linux and Microsoft Windows operating systems are supported, including Windows 10. A wide selection of add-ons is also available to facilitate design, including cooling solutions, I/O panels, and cable kits.
