Furthermore, they incorporate Intel Xeon D-2700 processors, with up to 20 cores, into the realm of demanding real-time mixed applications. Compared to the larger (200x160 mm) COM-HPC Server Size E modules, the number of supported DRAM modules is halved, from 8 to 4 sockets. Nevertheless, an impressive 512 GB of DDR4 RAM at 2,933 MT/s is provided. The advantage of limiting the RAM is that the modules occupy less space, reducing the required footprint by 20% compared to Size E. The applications targeted by the new COM-HPC modules based on the Intel Xeon D-2700 processor are space-constrained, deeply embedded edge server deployments that require high data throughput but less memory-intensive workloads. These are typically found in real-time environments connected to the IIoT network of smart factories and critical infrastructure.
“Our current release is best described as ‘less is more’: Mixed-edge server applications don’t have to handle RAM-intensive server workloads. Instead, they need to host multiple real-time applications side-by-side and therefore require the highest possible number of cores. They also have to meet the demands of industrial communications with many small message packets that need to be processed in real time. Again, memory isn’t as critical compared to database-driven web servers used by thousands of people in parallel. It’s true that customers can run the COM-HPC Server Size E modules with just four RAM slots. However, space savings are also very important to them. That’s why we now also offer the Intel Xeon processor in the COM-HPC Server Size D,” explains Martin Danzer, Head of Product Management at congatec.
Regardless of the specific server module configurations, all congatec COM-HPC Server modules with Intel Xeon (formerly Ice Lake D) processors in Size E and Size D, as well as the COM Express Type 7 form factor, accelerate the next generation of real-time microserver workloads in rugged environments and across extended temperature ranges. Enhancements include up to 20 cores, up to 1 TB of RAM, double the throughput per PCIe lane at Gen 4 speeds, and up to 100 GbE connectivity with TCC/TSN support. Target applications range from industrial workload consolidation servers for automation, robotics, and backend medical imaging to outdoor servers for energy utilities and critical infrastructure—such as smart grids for oil, gas, and electricity, as well as rail and communications networks—and also include vision-enabled applications such as autonomous vehicles and video infrastructure for surveillance and security.
In addition to significant bandwidth and performance improvements, congatec's server module families considerably extend the lifecycle of next-generation rugged server designs compared to standard servers, with long-term availability of up to ten years included in the roadmap. The module families also impress with a comprehensive suite of server-level features: For mission-critical designs, they offer powerful hardware security features including Intel Boot Guard, Intel Total Memory Encryption - Multi-Tenant (Intel TME-MT), and Intel Software Guard Extensions (Intel SGX). AI applications benefit from integrated hardware acceleration, including AVX-512 and VNNI.
congatec's
existing COM-HPC Server Size D product family with Intel Xeon D-1700 processors. Both processor series are based on the generation formerly known as Ice Lake. This release doubles the number of available cores in this compact, high-performance 160x160mm server module from 10 to 20. Memory support is expanded from three to four channels of DDR4 RAM, supporting up to 512GB at 2,933 MT/s. For connecting a wide range of dedicated controllers, compute accelerator cards, and NVMe storage media in rugged edge server installations, they feature 32 PCIe Gen 4 lanes in addition to 16 PCIe Gen 3 lanes. For real-time networking, there is one 2.5GbE port with TSN and TCC support, as well as expanded Ethernet bandwidth of 100Gbps in various configurations, including one 100GbE port, two 50GbE ports, four 25GbE ports, and several other configurations via KR or SFI interfaces. Other interfaces include four USB 3.1 and four USB 2.0 ports. For non-volatile storage, the modules optionally support an integrated eMMC 5.1 with a capacity of up to 128 GB, as well as two SATA III interfaces.
The new application-ready COM-HPC server modules come with comprehensive board support packages for Windows, Linux, and VxWorks. For workload consolidation, real-time virtual machine support is available thanks to congatec's extensive support for Real-Time Systems' RTS Hypervisor implementations. congatec also offers perfectly matched cooling solutions, ranging from powerful active cooling with a heat pipe adapter to fully passive cooling solutions for the best mechanical resistance against vibration and shock.
The new conga-HPC/sILH COM-HPC Server Size D (160x160mm) modules based on the Intel Xeon D-2700 processor will be available in the following variants:
More information about the conga-HPC/sILH COM-HPC Size server modules
Learn more about the new Intel Xeon D-2700 processors
