The starter kit is based on the congatec conga-HPC/cTLU COM-HPC PICMG module, which leverages the technology of 11th generation Intel® Core™ processors (codenamed Tiger Lake). This new generation is aimed at systems engineers working on the broadband connected edge devices emerging in the Industrial IoT. Target markets include medical, automation, transportation and autonomous mobility, as well as vision-based inspection and video surveillance systems, to name just a few.
The starter kit's various Ethernet configuration options range from 8x 1GbE and 2x 2.5GbE switching options, including TSN support, to dual 2x 10GbE connectivity. Congatec's comprehensive AI support for Basler's MIPI-CSI connected cameras adds greater application readiness to embedded systems connected to the Industrial IoT and Industry 4.0. AI and inference acceleration can be achieved with Intel® DL Boost running on CPU vector neural network instructions (VNNI) or 8-bit integer instructions on the GPU (Int8). In this context, the Intel Open Vino ecosystem's AI support is particularly appealing, offering a library of optimized functions and calls for OpenCV and OpenCL™ kernels to accelerate deep neural network workloads across multiple platforms and achieve faster, more accurate AI inference results. The presented suite is based on the following components of congatec's COM-HPC ecosystem :
- ATX compatible motherboard conga-HPC/EVAL-Client.
The ATX compatible motherboard conga-HPC/EVAL-Client incorporates all the interfaces specified by the new COM-HPC Client standard and supports the extended temperature range from -40°C to +85°C. It comes with two high-performance PCIe Gen4 x16 connectors, as well as a variety of LAN data bandwidths, data transfer methods, and connectors, including support for 2x 10GbE, 2.5GbE, and 1GbE. Through mezzanine cards, support can run higher-performance interfaces, up to 2x25GbE, making this evaluation platform ideal for massively connected edge devices. The board supports COM-HPC sizes A, B, and C and includes all the interfaces engineers need for programming, firmware flashing, and rebooting.
- New conga-HPC/cTLU COM-HPC Client Module:
The heart of the starter kit for COM-HPC Client designs, the conga-HPC/cTLU module, is available in various processor configurations. For each of these configurations, three different cooling solutions are available to accommodate the entire configurable 12-28W TPD range of 11th Generation Intel® Core™ processors.
