The SiP is compatible with SGET's OSM (Open Standard Module) standard. "Almost all the CPU's functions are available on the small board, which measures only 30 by 45 mm," explains Andreas Widder, Managing Director of ARIES Embedded. "The SiP module's 476 pins allow the CPU to be used transparently in demanding applications. It is characterized by its low power consumption, small form factor, and competitive cost." Thus, the MSMP1 is ideal for applications in IoT, medical technology, and industrial systems.
Versatile with low energy consumption
MSMP1 modules are scalable in terms of performance and memory expansion, allowing them to be individually tailored to the requirements of many projects. Packaged systems support 512 MB to 4 GB of DDR3L RAM and 4 to 64 GB of eMMC NAND Flash. Numerous interfaces include 10/100/1000 Mbit Ethernet, USB 2.0 host/OTG, 2x CAN, UART, I2C, SPI, ADC/DAC, as well as a parallel display interface and a camera input. The modules are available in the commercial temperature range of 0 °C to +70 °C, as well as in the industrial temperature range of -40 °C to +85 °C.
Samples of the MSMP1 SiP will be available starting in the third quarter of 2022. ARIES Embedded will begin serial production in the fourth quarter of 2022.
