The module is based on 13th Generation Intel® Core™ processors from the H, P, or U series, delivering high-level, scalable CPU computing performance in a small form factor. This allows system designers to choose from varying degrees of energy efficiency and performance, with up to fourteen cores and twenty threads, and a thermal power consumption of 15 to 35W. Furthermore, the Intel Iris® Xe Graphics Engine, with up to 96 execution units, helps accelerate graphics, multimedia, and AI-intensive tasks.
The module incorporates up to 64GB of memory, IBECC (in-band ECC) data protection and optional local NVMe, thus demonstrating its capabilities in demanding applications.
The card boasts a wide array of high-speed I/O ports, including PCI Express® Gen 4, USB 4, USB 3.2, USB 2.0, dual Gigabit Ethernet, MIPI-CSI, SATA, and serial. Multiple display options allow for the connection of up to four external displays via DDI, eDP, and USB 4 interfaces, each capable of transmitting four independent displays.
Tria guarantees long-term product availability because it is designed and manufactured in Germany. Maximum investment protection is achieved through full compliance with the open COM-HPC standard. System solutions can easily leverage increased performance and advanced technology by migrating to newer module generations as they become available in the future.
