Thanks to features like optional Intel Optane 2 memory and USB 3.1 Gen2, everyday tasks are even more efficient. The processor cores enable efficient task scheduling and also support the use of RTS hypervisor software for further optimization of I/O performance from the input channels to the processor cores.
Designed for harsh, space-constrained environments, the new high-end Intel Core i7, Core i5, Core i3, and Celeron processor boards and modules are the first in the industry to offer long-term availability of 10+ years. This new embedded x86 design principle is being launched at congatec and across the entire embedded board vendor space with the release of the new 8th generation Intel Core Mobile processor boards. In particular, addressing the longer lifecycle needs of the transportation and mobility sectors, these new boards and modules are also perfectly suited to all other embedded applications, such as medical equipment and industrial controls, embedded edge clients, and HMIs, by enabling extended lifecycles at no additional cost to customers.
“One of our main objectives is to simplify the use of embedded computing technology as much as possible for our OEM customers. That's why we offer our new embedded modules and boards based on 8th generation Intel Core Mobile processors, now with over 10 years of shelf life and a last-minute purchase agreement specifying up to 15 years of long-term availability from the outset, since 7 years is often insufficient for many high-end embedded computing sectors. Our extended lifecycle, which, incidentally, comes at no extra cost, helps OEMs extend their own product lifecycles for an even better return on investment,” explains Christian Eder, Marketing Director at congatec.
In the past, many high-end embedded applications tended toward lifecycles of less than seven years, as they often required a performance boost from next-generation processors before that point. But with increasing certification requirements in several new embedded application areas, such as mobile vehicles, OEMs are now equally interested in longer lifecycles. Extending the lifecycles of standard x86 embedded platforms to 10 or even 15 years off-platform is therefore a significant advantage for customers across the embedded computing market.
“We are very pleased to have embedded versions of this new Intel architecture in our hands with more than 10 years of long-term availability. Longer lifecycles are a key requirement in many of the mobile applications we target in rugged environments, where it is necessary to acquire and record high-speed data streams for 3D object recognition, LiDAR imaging, and mobile mapping. This is the same requirement our end customers expect from our data loggers used for monitoring wireless networks and testing systems in the automotive industry, or data loggers for test vehicles that store and analyze high-speed data streams from external sensors on solid-state drives or hard drives,” explains Thomas Hagios, CEO of MCTX Mobile & Embedded Computers GmbH.
The detailed feature set:
The new conga-TC370 COM Express Type 6 modules, the conga-JC370 embedded 3.5-inch SBCs, and the conga-IC370 Thin Mini-ITX motherboards feature the latest embedded Intel Core i7, Core i5, Core i3, and Celeron processors with a 15-year long-term availability. The memory is designed to meet the demands of consolidating applications across multiple operating systems on a single platform: two DDR4 SODIMM sockets with speeds up to 2400 MT/s are available for a total of up to 64 GB. For the first time, USB 3.1 Gen2 with transfer rates of 10 Gbps is now natively supported, making it possible to transfer even uncompressed UHD video from a USB camera or any other vision sensor. The new 3.5-inch SBCs deliver this performance via a USB-C connector that also supports one DisplayPort++ and power for peripheral devices, enabling a single-cable monitor connection for video, touch, and power. COM Express modules support the same feature set on motherboards. Additional interfaces vary depending on the form factor, but all support a total of three independent 60Hz UHD displays with resolutions up to 4096x2304 pixels, as well as one Gigabit Ethernet port (one with TSN support). The new boards and modules offer all this and many more interfaces with a cost-effective 15W TDP, scalable from 10W (800 MHz) to 25W (up to 4.6 GHz in Turbo Boost mode).
