With an Intel Core i5-8365UE, only 4GB of RAM (out of a possible 64GB), and running Windows 10 Pro, the tested version of the new Congatec 3.5-inch single-board computer (SBC) reached the 85th percentile in the overall UserBenchmark comparison. This means it ranked 15th out of 100, averaged across the results of thousands of computers, including those with significantly more power-hungry processors. A key indicator of the board's excellent design is the CPU's score of 73.1%. This confirms that the top overall score stems from excellent implementation, encompassing all components, including the chipset and external controllers.
"Everyone knows that even the biggest performance improvements in a processor can be lost if the final board design fails to deliver loss-free computing power across various industrial applications. Therefore, we are very proud that our new conga-JC370 3.5-inch SBCs have demonstrated their excellent computing performance in these tests. Furthermore, the test results underscore that congatec knows how to design best-in-class boards," says Martin Danzer, Director of Product Management at congatec.
The test also shows that the CPU performs very well at its 15W TDP when power consumption is taken into account. Consequently, the conga-JC370 was found to offer an extremely good power-to-watt ratio, as well as excellent thermal performance. When running a stress test on the SBC for almost an hour with an overall CPU utilization of 98.7%, no throttling was required to cool the CPU. This is important for all applications that rely on achieving full performance at all times. Even so, overall power consumption remained below 15W, and the average temperature was as low as 39.2°C, with a maximum of only 61°C. One reason for these exceptional results, besides the processor's microarchitecture, is the advanced, custom cooling provided by congatec for the conga-JC370 3.5-inch SBC. Cooling solutions for the new 3.5-inch SBC include a heat spreader, a passive design with no moving parts for rugged applications, and an active cooler for high-performance use cases. These application-ready cooling solutions are a significant benefit for OEMs seeking a ready-to-use commercial platform.
