These distributed AI solutions incorporate DeviceOn for Edge AI software, which simplifies AI lifecycle management, from AI container deployment and over-the-air AI model updates to retraining and performance optimization. DeviceOn for Edge AI also provides real-time monitoring and management across distributed AI devices and cloud-based AI. Combined with server-level AI performance, an industrial-grade design, and distributed management, the AIR-030 and EPC-R7300 are ideal solutions for AI applications in autonomous guided vehicles (AGVs), autonomous mobile robots (AMRs), robotics, and vision systems.

High-Performance AIR-030 Distributed AI Systems with Jetson AGX Orin.
The AIR-030 series, characterized by its robust design with dimensions of 200 x 220 x 74 mm (7.87” x 8.66” x 2.91”), delivers powerful AI inference capabilities thanks to the use of NVIDIA Jetson AGX Orin in energy-efficient autonomous machines. This distributed AI system features numerous I/O options, including CANBus for motion and direction control, LAN and optional PoE for camera input, and DI/O for sensor control. It also offers global protection and EMC certifications such as CE/FCC, CB, UL, BSMI, CCC, IEC 61000-6-2, and IEC 61000-6-4, making it ideal for real-time video analytics and AI-based robotics applications in heavy industry. The AIR-030 series supports various expansion modules to better accommodate different needs. Wireless and advanced distributed AI applications are supported by one M.2 B key 2280/3052 slot for NVMe storage and 5G connectivity, one M.2 2230 E key for Wi-Fi connectivity, and a PCIe x16 slot for connecting additional function cards. AI developers can also boost the performance of the AIR-030 series by adding a 10GbE card for high-speed data transmission or a GPU for high-performance graphics processing. The AIR-030 series is compatible with the Linux Ubuntu 20.04 operating environment and the NVIDIA JetPack 5.0 and later software development kit, as well as the Isaac platform, thereby reducing the time and cost of developing AI for production and robotics applications.

EPC-R7300 series industrial-grade Box PCs are compatible with Jetson Orin NX and Orin Nano modules.
The EPC-R7300 series incorporates a production-grade carrier board with a fully compatible form factor and pin configuration for Jetson Orin NX and Orin Nano modules. The EPC-R7300's high-quality aluminum housing, designed to serve as a complete industrial-grade system, enhances heat dissipation and electrostatic discharge (ESD) protection for optimal safety. Furthermore, its thermal design supports the installation of modular, module-specific heatsinks, allowing developers to implement thermal solutions based on their chosen Jetson module. Regarding I/O configuration, the EPC-R7300 series leverages the mechanical design of the UIO40-Express, and its carrier board utilizes application-oriented I/O expansion cards to increase its capacity. This provides developers with the flexibility to select I/O expansion cards such as serial ports (RS-232, RS-485), CANBus, isolated DI/DO, USB 2.0/3.0, and 4-port GbE cards for machine vision camera input, motion control, and sensing. Furthermore, Advantech's AIM-Linux software service provides UIO40-Express peripheral drivers for NVIDIA JetPack. This enables UIO40-Express functionality without additional integration effort. These features make the EPC-R7300 series an excellent choice for prototyping and mass deployment of AGVs, AMRs, and robotics in healthcare, agriculture, manufacturing, and logistics.