Equipped with a Freescale i.MX6 processor featuring a quad-core 1.0 GHz ARM Cortex-A9 SoC (System on a Chip) and three integrated graphics processing units (GPUs), the VIA AMOS-820 delivers optimized performance and power to meet the demanding requirements of the most advanced industrial and automotive applications. The VIA AMOS-820 boasts a robust, fanless design that enables a wide operating temperature range from -20°C to 65°C, a typical TDP (Thermal Design Power) of just 7 W, and compatibility with Linux Embedded, Windows Embedded Compact 7 (WEC 7), and Android operating systems. Supporting video capture and offering optional 3G connectivity, the VIA AMOS-820 is also ideal for video surveillance and supports Power over Ethernet (PoE) for seamless integration.
The VIA AMOS-820 combines a Freescale i.MX6 processor with four 1.0 GHz ARM Cortex-A9 SoC (System on a Chip) cores and three integrated graphics processing units (GPUs). It allows for the creation of a complete fanless system suitable for even the most demanding computing environments, all within a robust chassis measuring 15 x 4.6 x 10.8 cm (length x height x depth).
Onboard storage includes 4 GB of eMMC Flash and is expandable via a microSD card slot. Comprehensive input/output (I/O) functionality on the front and rear panels makes the VIA AMOS-820 a flexible solution suitable for a wide range of integration applications. Front I/O includes two COM ports, one DIO port, two CAN ports, one USB 2.0 port, and one Micro USB 2.0 OTG port, as well as audio input/output and a microphone input. Rear I/O includes one HDMI port, one composite RCA connector, one Gigabit LAN port, one microSD card slot, and two USB 2.0 ports. An optional 3G/Wi-Fi connection is available and can be added via the board's USB headers or the Mini PCIe slot.
