The development of the YSi-V 12M TypeHS2 aimed for faster processing through improved image processing hardware and enhanced image inspection algorithms, achieving a more than 20% increase in three-dimensional inspection speed compared to the existing model. Specifically, the new model offers a significant speed increase of approximately 40% compared to the existing model on printed circuit boards (PCBs) with numerous component mounting points.
New features include a high-precision mode, enabling the capture of clear three-dimensional images. The 7 μm high-precision resolution mode incorporates a completely new dedicated three-dimensional imaging optical system, significantly improving the reproducibility of extremely small components down to 0.201 (0.25 x 0.125 mm) and increasing the repeatability of height measurements.
Furthermore, the optimization of image capture parameters and the use of newly developed algorithms has enabled the inspection capability to be compatible with thin and highly integrated WLCSP and FOWLP components, whose use in the market has increased dramatically since last year.
