This version of the software provides designers who characterize and model semiconductor devices with new advances in modeling and characterization efficiency.
IC-CAP 2016
software is a device modeling program that provides powerful characterization and analysis capabilities for today's semiconductor modeling processes. IC-CAP 2016 offers a complete DynaFET solution for modeling GaN and GaAs HEMTs used in power amplifier applications. IC-CAP includes measurement and modeling software to extract DynaFETs from the Advanced Design System (ADS), an internally developed model for GaAs and GaN HEMT devices.
The main advantage of ADS's DynaFET model is its ability to accurately predict dynamic memory effects caused by thermal and capture phenomena. This translates into unprecedented accuracy in predicting gain and power added efficiency (PAE), two key merit factors in RF power amplifier circuit design. Dedicated measurement software collects large-signal data using a Keysight nonlinear network analyzer (NVNA). The waveforms, representing dynamic load lines measured at different RF power levels, bias points, and output impedances, are then directly imported into the IC-CAP 2016 extraction package. IC-CAP 2016 extracts the model using artificial neural network technology, and this model can then be used directly in ADS's software.
Another key feature of IC-CAP 2016 is the increased measurement speed for the Keysight E5270, B1500A, and B1505A instrument drivers—up to three times faster than previous versions. This increased measurement speed helps reduce the time-consuming process of accurately measuring large amounts of data. New instrument drivers have also been added to IC-CAP 2016 to support the Keysight E4990 impedance analyzer and E5061B network analyzer.
More information about IC-CAP 2016
Keysight's MBP 2016 is a comprehensive solution that provides automation and flexibility for modeling high-volume, high-throughput devices, while MQA 2016 provides thriftless design companies, embedded device manufacturers, and foundries with the complete solution and environment for validating, comparing, and documenting SPICE model libraries. The MBP 2016 extraction package has been updated to support version 102.6 of the BSIM-IMG industry standard. To work with silicon on fully depleted insulators (FD-SOI), a widely used technology for sub-28 nm nodes, Keysight is developing modeling technologies for the Leti-UTSOI model.
“We continue to invest in our device modeling platforms with a strong focus on efficiency and emerging technologies such as DynaFET and FD-SOI modeling,” explains Roberto Tinti, Director of Device Modeling Planning at Keysight. “Our goal is to enable modeling engineers to generate high-quality models in less time. We will also continue to collaborate with Keysight Research Labs and our global partners to develop turnkey modeling solutions for the advanced technologies on our platforms.”.
MBP 2016 also incorporates a new statistical corner tuning module designed to further increase the efficiency of daily modeling. The module integrates all the necessary components for automated tuning or optimization, including predefined targets and graphs.
MQA 2016 offers improved support for advanced 16nm TMI libraries and mixed SPICE syntax. This latter capability is important because, as technology nodes shrink, SPICE model libraries become increasingly complex. Furthermore, MQA 2016's 64-bit operating system support makes the software suitable for loading and managing large model libraries and data.
More information about MBP 2016 and MQA 2016
About Keysight EEsof EDA Software
Keysight EEsof EDA is the leading provider of electronic design automation (EDA) software for microwave, RF, high-frequency, high-speed digital, RF system, electronic system-level, circuit, 3D electromagnetic, physical design, and device modeling applications. For more information, see Learn More
