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- Category: Embedded Systems
Red Pitaya has announced a new board developed in collaboration with Texas Instruments. The new STEMlab TI board is designed for advanced signal processing applications in photonics, sensors, and laboratory automation. It leverages key Texas Instruments components to deliver high accuracy, low power consumption, and ultra-low jitter performance in a compact form factor.
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- Category: Power Supplies
Danisense introduces the DSSIU-1-V, a new low-noise interface unit and power supply designed to support a wide range of its fluxgate current transducers (DCCT). Featuring an industry-standard D-sub-9 connector, the DSSIU-1-V ensures a reliable and straightforward interface.
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- Category: Other Components
Parker Hannifin Corporation's Chomerics Division has introduced a new low-hardness EMI shielding gasket for use in military and commercial electronics applications. CHO-SEAL® 1299 offers lower hardness (typically only 45 Shore A) while still providing effective shielding and corrosion resistance against aluminum.
CHO-SEAL® 1299 is an electrically conductive elastomer EMI shielding gasket made of passivated silver-plated aluminum particles in a fluorosilicone adhesive.
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- Category: Software
IAR has released new versions of its development toolchains. The IAR toolchains for Renesas RX version 5.20 and RL78 version 5.20 extend support for these strategic architectures within IAR's integrated development platform. These updates bring modern development capabilities, such as IC/CD integration and cross-platform compatibility, to developers working with Renesas-based microcontrollers (MCUs) for industrial, automotive, and consumer applications.
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- Category: Current Affairs
Siemens Digital Industries Software has introduced its enhanced AI-powered toolset for the EDA design workflow. This new AI system for EDA is designed specifically for semiconductor and PCB design environments. It offers advanced, secure, and generative AI and agentic capabilities, providing unprecedented customization options and seamless integration across the entire EDA workflow.
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- Category: Liabilities
Würth Elektronik has expanded its family of high-current power inductors with the WE-XHMI-Performance series, which incorporates improved versions in sizes 1010, 1060, 6030, and 6060. These magnetically shielded, flat copper wire inductors allow for high saturation currents, reducing DC losses for even more efficient operation.
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- Category: Other Semiconductors
Nexperia today announced a range of highly efficient and robust automotive-grade silicon carbide (SiC) MOSFETs with RDS(on) values of 30, 40, and 60 mΩ. These devices (NSF030120D7A0-Q, NSF040120D7A1-Q, NSF060120D7A0-Q), which offer industry-leading figures of merit (FoM), were previously available in industrial grade and have now achieved AEC-Q101 certification.
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- Category: Test and Measurement Equipment
Siglent introduces the latest addition to its range of high-performance 12-bit oscilloscopes: the SDS5000X HD and SDS5000L series. These new oscilloscopes offer up to 8 channels, bandwidth up to 1 GHz, and represent an advancement in Siglent's multi-channel platform strategy. With high-speed sampling and a deep memory architecture, these instruments are designed to provide reliable insights into complex signal environments.
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- Category: Other Components
Amphenol Industrial Operations presents a complete line of cable glands, vents, and accessories designed to secure system connections across a wide range of industries. The new GuardXcel series provides high-quality protection for cabinets, connections, and system cables, extending the life of systems and their components.
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- Category: Integrated Circuits
International cybersecurity standards continue to adapt to escalating threats, and a key area of focus is outdated firmware in IoT devices, which can present significant security vulnerabilities. To address this, Microchip Technology is introducing enhancements to its TrustMANAGER platform to incorporate secure code signing and over-the-air (FOTA) firmware updates, as well as remote management of firmware images, cryptographic keys, and digital certificates.
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- Category: Technology
The performance of modern AI and high-performance computing applications can only be achieved with high-performance semiconductor technology. Advanced Packaging allows multiple processing units to be housed on a single chip, significantly increasing power density. At productronica, the world trade fair for the development and production of electronics, the industry will gather in Munich from November 18–21, 2025, to discuss the latest trends.
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- Category: Current Affairs
Nordic Semiconductor has announced the acquisition of its partner Memfault Inc., a leading provider of cloud platforms for large-scale deployments of connected products. This marks a significant step in Nordic's evolution from a hardware vendor to a full-solutions partner.
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