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- Category: Current Affairs
AMI® and congatec today announced the celebration of the 20th anniversary of their business partnership. Since 2005, AMI and congatec have worked closely together to deliver innovative embedded systems solutions to customers worldwide. This long-standing collaboration has enabled both companies to develop advanced technologies and provide exceptional support to their shared customer base, even for the most sophisticated technical challenges in embedded systems.
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- Category: Embedded Systems
Congatec presents its heat pipe cooling solution for extreme environmental conditions. The new cooling solution uses acetone as the working fluid in the heat pipes instead of water. This prevents the heat transfer medium from freezing at extreme sub-zero temperatures and avoids damage to the cooling solution, the module, and the entire system design.
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- Category: Embedded Systems
congatec boosts AI performance for medical, robotics, industrial, retail, and gaming applications, delivering up to 99 TOPS (Tera Operations Per Second). This AI performance is powered by the new conga-TC750 Computer-on-Module (COM) in the COM Express Compact Type 6 form factor, which works with Intel Core Ultra Series 2 processors (codenamed Arrow Lake)
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- Category: UPS and Rectifiers
The SPS HOME+, an evolution of the SPS HOME Uninterruptible Power Supply (UPS), is now Line Interactive and has more power outlets. It incorporates improvements in technology, capacity, and functionality compared to its predecessor. It is ideal for home and office environments.
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- Category: Integrated Circuits
Renesas Electronics Corporation has expanded its RZ/V series of microprocessors (MPUs) with a new device targeting the high-volume vision AI market. Like its high-end counterpart, the RZ/V2H, the new RZ/V2N MPU features Renesas' proprietary AI accelerator, the DRP (Dynamically reconfigurable processor) -AI3, which boasts an energy efficiency of 10 TOPS/W (Tera Operations Per Second Per Watt)
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- Category: Liabilities
Mouser now has the Molex MX-DaSH wire-to-wire connection system in stock. The MX-DaSH connection system combines power, ground, and high-speed data connectivity into a single connection system. The MX-DaSH is a unified solution for compact connectivity in electronic control units (ECUs) and controllers.
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- Category: Test and Measurement Equipment
Spectrum Instrumentation introduces seven new digitizers. Using a simple Ethernet/LXI cable, the DN2.33x series products can be connected to a PC, laptop, or even a company network. The instruments are also compact and portable. Electronic signals are acquired using A/D converter technology, capable of sampling at rates between 3.2 GS/s and 10 GS/s, with 12-bit vertical resolution and bandwidths between 1 GHz and 4.7 GHz.
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- Category: Embedded Systems
Tria Technologies introduces the Tria™ C6C-RYZ8 COM Express Compact Type 6 module, based on the AMD Ryzen™ processor. This new addition to Tria's COM Express card family is based on AMD's Zen 4 CPU architecture and delivers a substantial performance improvement over previous generations of cards with AMD processors.
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- Category: Embedded Systems
Sfera Labs announces the launch of the X2-Series Standard Electrical and Mechanical Specifications, an open standard designed to encourage innovation and customization in industrial automation and IoT applications.
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- Category: Current Affairs
Farnell has announced the results of its first buyer survey. The survey was designed to provide detailed information on the priorities and preferences of buyers in the engineering and electronics industry.
With over 900 participants, the survey results shed light on the factors that influence supplier selection, loyalty, and purchasing decisions within the sector.
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- Category: Batteries
Dukosi Ltd has unveiled a reference design for battery energy storage systems (BESS). This proof of concept (PoC) represents a comprehensive solution incorporating 54 cells, which is standard for suitable battery module configurations in a 900-1500 V BESS rack.
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- Category: Software
Software developer CoreTechnologie has released a new version of its proven 3D_Evolution Simplifier software for optimized generation of envelope geometry.
The Franco-German software company CoreTechnologie has launched the latest version of its 3D_Evolution Simplifier software, version 4.8 SP1. This tool offers optimized automatic generation of envelope geometries for detailed 3D models.
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