with Lion Cove and Skymont P and E cores, providing up to 16 cores and 22 threads along with an integrated GPU and NPU.
Developers already working with COM Express Compact (95 mm x 95 mm) platforms, such as the conga-TC700, will particularly benefit from the rapid upgrade path to unprecedented AI performance. Applications with high-performance requirements, especially in graphics and AI, can leverage the enhanced x86 and AI capabilities offered by Intel's new System-on-Chip (SoC) with minimal development effort and faster time to market.
The SoC achieves 99 TOPS by combining the exceptional AI performance of the Intel Xe-LPG+ integrated graphics processor (iGPU), optimized for high-performance parallel workloads and delivering up to 77 TOPS (compared to 18 TOPS in its predecessor, Meteor Lake), with a highly energy-efficient NPU providing up to 13 TOPS, and a CPU contributing 9 TOPS for fast response times. The new SoC also features Intel's latest Xe-LPG+ graphics engine. With its standardized module concept enabling easy upgrades and high scalability, the conga-TC750 is an excellent choice for IPCs and high-performance thin clients, allowing them to stay current with simple module replacements. Furthermore, medical imaging, test and measurement, and AI-based graphics applications greatly benefit from the significant performance of the new module.
“Our new conga-TC750 compact COM Express modules with Intel Core 2 Ultra series processors are ideal for applications that always require the latest performance and follow innovation cycles of three to five years. The module concept goes beyond these scenarios, providing an application-ready compute core that helps developers save time and costs during design, scale easily, and achieve a shorter time to market. By replacing the modules and retaining the motherboard, developers avoid the expense and effort of replacing or redesigning an entire system,” explains Maximilian Gerstl, product manager at congatec.
The feature set in detail
The new COM Express Compact conga-TC750 modules work with Intel Core Ultra Series 2 processors and have a long-term availability of five years. This makes them ideal for high-performance applications that require upgrades every three to five years.
Beyond its impressive 99 TOPS AI performance, the conga-TC750 modules also offer up to 128 GB of DDR5 memory with speeds up to 6400 MT/s and in-band ECC. An optional NVMe x4 SSD provides up to 1 TB of non-volatile storage. To meet future connectivity demands, the modules feature a 2.5 GbE port via the Intel i226 Ethernet controller with TSN support. They also provide comprehensive peripheral connectivity, including up to 16 PCIe Gen4/5 lanes, two USB 4.0 ports, four USB 3.2 Gen2 ports, and eight USB 2.0 ports, as well as SATA, UART, GPIO, SPI, LPC, and I2C. Supported operating systems include Microsoft Windows 11, Windows 10/11 IoT Enterprise, ctrlX OS, Ubuntu, Linux, and Yocto. The conga-TC750 also enables system consolidation through Real-Time Systems' integrated Hypervisor-on-Module.
Furthermore, the conga-TC750 is available as an application-ready aReady.COM module and can, for example, be pre-configured with the Bosch Rexroth licensed ctrlX operating system and Ubuntu Pro. The aReady.VT option allows developers to consolidate multiple workloads, such as real-time control, HMI, AI, and IoT gateway functions, into a single module. For IIoT connectivity, congatec offers its aReady.IOT software building blocks, which enable data exchange, maintenance/management of the module, carrier, and peripherals, as well as on-demand cloud connectivity. To further simplify application development, congatec provides a comprehensive ecosystem that includes evaluation- and production-ready motherboards, customized cooling solutions, complete documentation, design services, and high-speed signal integrity measurements.
The new COM Express Compact conga-TC750 modules are available in the following versions:
