The new cooling solution is also insensitive to mechanical stresses such as shocks and vibrations.
With these characteristics, the acetone-based cooling solution expands the application possibilities of Computer-on-Module (COM) modules to use cases involving extreme climatic and mechanical conditions, such as arctic temperatures. It enables the use of COM modules in systems that previously relied on more elaborate, complex, and expensive Commercial Off-The-Shelf (COTS) system designs—either slot-based or fully customized—to achieve the required reliability, thus reducing costs and safeguarding performance in demanding system applications. These properties make it the ideal choice for all designs that must operate reliably within a temperature range of -40°C to +85°C.
Jürgen Jungbauer, senior product line manager at congatec, explains: “Our new acetone-based cooling solution expands module-based designs to include applications in extreme operating conditions that were previously unattainable with conventional cooling solutions. Using our application-ready COMs instead of expensive slots or special solutions allows developers to optimize time to market while reducing development effort and overall application costs.”
Applications for the new heat pipe cooling system include autonomous and conventional vehicles exposed to extreme conditions, such as logistics vehicles in ports, airports, and cold storage facilities. The new solution is equally effective in rail and aviation systems, and in any other scenario where extreme temperatures and mechanical stresses could affect system reliability.
When combined with the ultra-rugged conga-TC675 or conga-TC675r Type6 COM modules, the heat pipe cooling solution is particularly effective. It also provides an ideal cooling solution for COM modules in COM-HPC Mini and Client formats, as well as COM-HPC Server for rugged edge servers. The new cooling solution will also be available as a heat pipe adapter and in other configurations upon request.
This latest development reaffirms congatec's reputation for developing solutions that offer efficient heat dissipation for effective cooling of high-pressure hotspots. The company's holistic approach to developing high-performance COM ecosystems encompasses suitable cooling solutions, motherboards, and comprehensive services, significantly simplifying and accelerating application development.
Jürgen Jungbauer concludes: “We have always placed the utmost importance on high-performance cooling for reliable computing. Our acetone-based cooling solution once again demonstrates our technological leadership in high-performance COM module ecosystems.”
