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- Category: Other Semiconductors
Widespread electrification is driving the growth of SiC semiconductors as large market segments such as electromobility, sustainability, and industry turn to SiC-based power solutions thanks to their fast switching capabilities, lower power losses, and high performance at high temperatures.
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- Category: Other products
Mouser Electronics, Inc. offers a resource site for development kits and a page dedicated to the latest engineering tools. The development kit resource site includes various articles, videos, and tutorials, and connects engineers directly with the products and knowledge needed to develop new products.
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- Category: Electrical Analyzers
Keysight presents a comprehensive emulation solution that identifies the impact of variables affecting battery drain in Internet of Things (IoT) devices so that development engineers can improve the design of their devices.
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- Category: Technology
This month saw the launch of the D-CARBONIZE project, a joint doctoral network aiming to promote new approaches to circular chemistry for designing and developing recyclable bioplastics from biomass. To this end, the consortium has opened the selection process for 12 doctoral candidates who wish to join the network and become future leaders in the field of sustainable polymers, depolymerization techniques, biocarbon valorization, and innovative catalytic strategies.
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- Category: Current Affairs
Graduated engineers use power converter datasheets and have a good grasp of many technical concepts. However, through Traco Power's ongoing relationship with students, it's true that not all aspects of power supply details are fully understood or grasped instantly. With this in mind, Traco Power is launching a technical blog.
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- Category: Other Components
Qorvo® has announced the expansion of its power management product portfolio to include the PAC22140 and PAC25140 Power Application Controller® (PAC) devices. These two PACs are the industry's first single-chip solutions to support battery packs of up to 20 cells in series (20s).
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- Category: Other Components
Qorvo® introduces a new surface-mount TO-leadless (TOLL) package for its high-performance 750V 5.4mΩ SiC FETs. This is the first product in a family of 750V SiC FETs to be released in the TOLL package with RDS(on) ranging from 5.4mΩ to 60mΩ. These devices are ideal for use in space-constrained applications such as AC/DC power supplies from several hundred watts to several kilowatts, as well as solid-state relays and circuit breakers up to 100A.
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- Category: Other Components
Mecter, HopeRF's distributor for Spain and Portugal, presents the new RFM90CW LoRa transceiver. The RFM90CW LoRa module incorporates Semtech's new SX1262 chipset. Its main new feature, and what sets it apart from its predecessors, is its ability to deliver up to +22dBm of power, compared to +20dBm for previous modules.
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- Category: Other products
MikroElektronika (MIKROE) has released the latest version of its Integrated Development Environment (IDE), NECTO™ Studio, which includes a powerful AI engine, AI Assistant, enabling natural language processing. Another new feature in NECTO Studio 3.0—especially useful for Planet Debug™ users—is its ability to continuously receive data from remote development boards such as Clicks™.
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- Category: Other Semiconductors
EPS Global, a global organization in integrated circuit programming services and secure encryption, has announced a secure programming service that meets the requirements of international legislation on cybersecurity measures for Internet-connected devices.
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- Category: UPS and Rectifiers
Vertiv introduces the new Vertiv™ NetSure™ IPE outdoor rectifier, designed to facilitate 5G deployment and enable operators to increase capacity in areas with high data demand. These easy-to-deploy devices, available with lithium-ion batteries, help minimize power losses when powering radios atop towers and rooftops, common in these applications. The NetSure™ IPE R48-2000C2 rectifier is now available worldwide.
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- Category: Embedded Systems
Duagon introduces the F27P, a new family of CompactPCI PlusIO CPU motherboards (PICMG 2.30 standard) based on the AMD Ryzen Embedded APU family. The design supports dual-core and quad-core CPUs, such as the AMD V1404I or AMD V1807B, with a moderate TDP range of 12W to 54W, delivering high performance suitable for the computing power needs of customer applications, scaling from mid-range to high-end.
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