With its embedded design for harsh environments, the F27P is suitable for the railway market, industrial automation or the energy sector, among others.
In accordance with the CompactPCI PlusIO (PICMG 2.30) specification, the board can be used in a hybrid system for controlling CompactPCI and CompactPCI Serial peripheral cards.
For high-volume data tasks, the F27P is equipped with up to 32 GB of soldered DDR4 RAM with ECC and eMMC. Non-volatile RAM (FRAM) can permanently store critical runtime data. Mass storage can be added via an expansion card compatible with 2.5" HDD/SSD and NVMe devices.
For security-related monitoring, the F27P incorporates an advanced Board Management Controller (BMC) that monitors voltages and temperature and performs specific tasks such as watchdog timer management, power supply control, and reboot management. A Trusted Platform Module (TPM 2.0) enables secure remote device authentication, measured boot, and secure updates.
The F27P incorporates up to three front-facing Ethernet RJ45 (single slot) or modular M12 (dual slot) connectors in 4 HP or 8 HP configurations, making it more versatile for retrofit applications that cover different M12 encoding variants. Other front-facing I/O ports include two USB 3.2 Gen 1x1 connectors and one DisplayPort connector.
The design includes an optional expansion card for additional I/O. Besides mass storage, several USB and UART interfaces can handle legacy tasks. This saves users cost and space, especially in retrofit applications. Even with the expansion card, the F27P remains a compact CPU unit. Regarding CPU board modularity, the available processor and I/O options are supported by a custom thermal design.
The F27P is designed to withstand extreme operating temperatures, ranging from -40°C to +70°C (system ambient temperature), as well as shock and vibration in applications where high reliability and long-term availability are essential. This is the case in the rail, transportation, industrial automation, and energy markets. The board is available as a passively cooled model, supporting system ambient temperatures up to +70°C, and as a high-performance model with forced air convection cooling for moderate temperature requirements.
Furthermore, the F27P offers customized BMC, BIOS, lifecycle extension, and cybersecurity services. The board is available with long-term availability.
