RSS feed
- Details
- Category: Technology
Printed electronics on flexible or unconventional substrates is a technology experiencing remarkable growth worldwide. A report by the consulting firm Fortune Business Insights projects that the market for these new solutions will reach $69.54 billion by 2032. This technology enables the development of products with integrated electronic capabilities, such as in-mould electronics (electronics embedded in plastic parts) or electronics integrated into composites, and offers enormous potential for creating innovative solutions in sectors such as automotive, aerospace, and healthcare.
- Details
- Category: Lighting
ISPLAY VISIONS has expanded its range of display accessories with new light guides. Available in various sizes, these light guides have been developed as a particularly cost-effective, high-performance solution for backlighting the popular EA DOGM and EA DOGL series of graphic displays.
- Details
- Category: Embedded Systems
Kontron Electronics, a comprehensive service provider for the electronics industry, expands its product portfolio with the OSM-S AM62L, a compact system-on-a-module (SoM) compliant with the OSM standard. The module incorporates a low-power dual-core Arm® Cortex®-A53 processor from Texas Instruments, running at 1.25 GHz, and offers an optimal balance of performance, power consumption, and competitive pricing.
- Details
- Category: Converters
Motherboard-cooled modules require additional external components for proper operation, including reverse polarity protection, noise emission control, and protection against spikes and surges.
When designing electrical equipment for outdoor or harsh environments, several design challenges must be overcome. First, the equipment must be sealed against external environmental conditions, and second, a reliable power supply is required.
- Details
- Category: Embedded Systems
The COM module market size was valued at $3.17 million in 2024 and is expected to reach $5.92 million by 2033, with a compound annual growth rate of 8.11% between 2025 and 2033. According to the latest Markets Report World report, the computer-on-a-module (COM) market is experiencing significant growth, driven by the increasing demand for compact and energy-efficient computing solutions across various sectors.
- Details
- Category: Test and Measurement Equipment
Emerson today announced the launch of the NI USRP X420, a software-defined radio (SDR) designed to meet the demanding requirements of advanced radar systems, satellite communications, and emerging 6G technology research. The X420 expands the NI Universal Software Radio Peripheral (USRP) product line with frequency coverage up to 20 gigahertz.
- Details
- Category: Test and Measurement Equipment
The UDE® Universal Debug Engine 2026 debugging, tracing and testing tool, presented by PLS Programmierbare Logik & Systeme, now allows the debugging, runtime monitoring and validation of special data flow-oriented algorithms, such as those currently used in embedded artificial intelligence applications.
- Details
- Category: Current Affairs
Renesas Electronics Corporation has announced that its automotive ADAS system-on-a-chip (SoC), R-Car V4H, has been selected for the TSS (LSS) control unit used in the new Toyota RAV4 model, introduced in December 2025. The control unit is supplied by Denso Corporation.
- Details
- Category: Current Affairs
element14, an Avnet community, in collaboration with ADI, has launched a new design challenge aimed at engineers and developers to create advanced security and surveillance prototypes.
Participants will need to design a prototype or test bench using ADI's MAX32630FTHR development platform and Würth Elektronik's SMD LEDs with an integrated WL-ICLED controller.
- Details
- Category: Design
LGA vs. BGA: Which Package Should You Use for Your PCB? Both are essential for connecting integrated circuits and circuit boards, but each has advantages and is suited to different situations. LGA packages are easy to rework and inspect, making them ideal for high-value or replaceable components.
- Details
- Category: Electromechanical
HARTING Technology Group presents the new PushPull V4 Power QuickLock. This product incorporates Han QuickLock termination technology, which allows for quick, tool-free assembly directly on the installation site.
- Details
- Category: Test and Measurement Equipment
The Teledyne SP Devices ADQ35 is part of the 12-bit ADQ3 series and offers a good combination of speed, resolution, and flexibility, making it ideal for scientific, industrial, and OEM applications. It is designed for use in areas such as scanning source optical coherence tomography (SS OCT), time-of-flight mass spectrometry, distributed fiber optic sensing, and LiDAR
Spanish electronics magazine. Printed for over 25 years.
Spain - Madrid - All rights reserved © Convertronic Professional Spanish Electronics Magazine.