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- Category: Current Affairs
The Spanish Institute of Engineering (IIE) has launched the third edition of its Young Engineers for a Better World competition. The aim is to recognize projects focused on achieving social progress and environmental improvements. The awards consist of two prizes of €2,000 and €1,000, respectively, and €1,500 for the winner of the Best Entrepreneurial Project Award.
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dSPACE and MathWorks, a developer of mathematical computing software, have expanded their collaboration to optimize traffic simulation using open standards.
Developers of autonomous driving applications can now directly use road models created in RoadRunner within ASM OpenX, dSPACE's latest generation of traffic models.
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- Category: Other Semiconductors
ROHM has expanded its range of low voltage (40V/60V) MOSFETs for automotive applications — such as main control circuits for inverters, electric pumps and LED headlights — with the introduction of new products that adopt the new HPLF5060 package (4.9 mm × 6.0 mm).
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GS Yuasa has begun operating a new battery storage system integrated with renewable energy at the Ene-Seed Nagasaki No. 2 solar power plant in Nagasaki, Japan. The project, developed in partnership with Ene-Seed Corporation, a Saibu Gas Group subsidiary, and Toshiba Energy Systems & Solutions Corporation, marks Saibu Gas Group's first use of battery storage directly integrated with renewable energy generation.
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Farnell EMEA, a distributor of electronic components, products, and solutions, has announced its return to Embedded World 2026, taking place from March 10-12, 2026, at Nürnberg Messe in Germany. Farnell will be located in Hall 3A, Stand 119, where it will showcase a program packed with hands-on workshops, live demonstrations, and community-led activities designed to help engineers quickly implement ideas.
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- Category: Other Semiconductors
Renesas Electronics Corporation has developed three System-on-Chip (SoC) technologies for multi-domain automotive electronic control units (ECUs). These incorporate advanced AI processing capabilities and chiplet functions, forming the core technology platform for next-generation electrical/electronic (E/E) architectures in the automotive industry.
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- Category: Test and Measurement Equipment
IPTE expands the Multi-Functional Test Handler (MFT) family with the introduction of the new MFT 900, developed to meet the growing market demand for testing larger PCBs in automated production environments.
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- Category: Embedded Systems
The ADLINK cExpress-R8 is a compact COM Express® R3.1 Type 6 (95 × 95 mm) module designed for demanding edge-AI applications. It is powered by AMD Ryzen Embedded 8000 Series processors with up to eight Zen 4 CPU cores, integrated RDNA™ 3 GPU architecture, and an XDNA™ NPU for AI acceleration, delivering up to 40 TOPS of combined CPU, GPU, and NPU performance.
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Mouser Electronics Inc., the global authorized distributor of cutting-edge electronic components and semiconductors, today announced a distribution agreement with iC-Haus GmbH, a German provider of semiconductors and innovative sensing, motion, and light solutions. iC-Haus develops and manufactures application-specific standard products (ASSPs) and custom integrated circuits, enabling the easy implementation of complex, high-end applications.
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Harwin has launched an online 3D virtual showroom for its high-reliability (HRi) product lines. It is designed to enhance how customers discover, explore, and engage with Harwin and its products, helping engineers better visualize and evaluate connectors and cable assemblies for key application areas.
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- Category: Test and Measurement Equipment
Rohde & Schwarz offers a powerful tool for remotely controlling its oscilloscopes: the RsInstrument Python module. This module allows users to control and automate their Rohde & Schwarz test and measurement instruments, including oscilloscopes, using Python scripts or interactive console communication.
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OSP, the Open Systems Protocol developed by ams OSRAM for dynamic lighting and smart grids in vehicles, is progressing towards becoming an international standard. The International Organization for Standardization (ISO) Technical Committee TC 22 (Road Vehicles) has begun the standardization process for OSP as a new project within ISO/TC22/SC31/WG3.
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