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The first quarter of a fiscal year typically sets the tone for speculation about how the full year will turn out. According to DMASS Europe eV, the European component distribution market, which had enjoyed three years of significant growth, saw a decline of more than 23% across all components, indicating it will face some challenging quarters. Consolidated distribution revenues from reporting members fell by 23.3% to €4.58 billion.
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Heilind Electronics Europe, a global distributor of interconnects, electromechanical components and fasteners, has opened a new state-of-the-art distribution center in Hanau, near Frankfurt, Germany.
The inauguration, which took place on April 23, reinforces Heilind's commitment to supporting European innovation while expanding its presence in Western Europe. This new center will strengthen the company's position in the region while supporting growth in Central and Western Europe, specifically in the DACH region, Benelux, Italy, and France, for the Industrial and MIL/Aero businesses.
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PICMG has initiated a partnership with The Open Group Open Process Automation™ Forum (OPAF) to collaboratively develop interoperable and interchangeable technology specifications for the process control industry. This partnership fills a gap in edge controller hardware that exists within the O-PAS™ Standard—an open architectural framework for developing industrial process automation systems, currently being defined by OPAF initiatives.
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RECOM announces the launch of an advanced manufacturing and after-sales service facility in Bangkok, Thailand. This strategic move aims to enhance service quality for the global market and local customers while mitigating supply chain risks.
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The signing of the Stockholm Convention on Persistent Organic Pollutants (POPs) in 2001 marked a historic moment, as it was the first global treaty aimed at eliminating or restricting chemicals harmful to human health and the environment. The inclusion of perfluorooctanesulfonic acid (PFOS) in the Convention in 2009 marked another milestone, as PFOS and related substances became the first in the PFAS family to be regulated internationally.
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Health-tracking apps can help people manage chronic conditions or stay fit with nothing more than a smartphone. However, these apps can be slow and energy-inefficient, as the massive machine learning models that power them must move between a smartphone and a mainframe server.
Engineers often speed things up by using hardware that reduces the need to move so much data around. While these machine learning accelerators can speed up calculations, they are susceptible to attackers stealing sensitive information.
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3D electronics is an emerging manufacturing method that allows electronic components to be integrated into or on the surface of objects. 3D electronics manufacturing techniques enable new features such as mass customization, greater integration, and improved sustainability in the electronics industry. There are three main approaches to 3D electronics: applying electronics to a 3D surface, in-mold electronics, and fully 3D printed electronics.
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ROHM and STMicroelectronics have announced the extension of their long-term, multi-year supply agreement for 150 mm silicon carbide (SiC) substrate wafers with SiCrystal, a ROHM group company. The new multi-year agreement governs the supply of larger volumes of SiC substrate wafers manufactured in Nuremberg, Germany, with a minimum anticipated value of $230 million.
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This new factory is part of LEM's growth plan, driven by increasing global demand for the company's core products: its current and voltage sensors. The need to decarbonize mobility, industry, and power generation, as well as our personal lives, has led to greater demand for LEM products across all sectors where they are used, including automation, automotive, traction, and renewable energy.
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Semiconductor packaging has evolved from traditional 1D printed circuit board levels to next-generation 3D hybrid junctions at the wafer level, achieving interconnect steps as small as a single micrometer and bandwidths exceeding 1,000 GB/s. Key parameters include power, performance, surface area, and cost. Energy efficiency is improved through innovative packaging techniques, while performance benefits from shorter interconnect steps.
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Head-up displays (HUDs) for cars are being met with great enthusiasm. The increased use of technology while driving, and the fact that drivers have to take their eyes off the road to look at the dashboard and central information displays (CIDs), has led to more traffic accidents over the years. Drivers must look away from the road to check on-board diagnostics (ABDs), GPS navigation, select music, and so on.
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- Category: Events
The conference running alongside the PCIM 2024 exhibition offers a diverse program with over 500 presentations. The four-stage program focuses on the latest products, developments, and trends in the industry and will feature presentations from leading specialists.
In Hall 5, visitors can attend the new Smart Power System Integration Stage, showcasing innovative solutions and application examples for the challenges of power electronics production: from Smart Power Embedding to Integrated Smart Power Circuits.
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