roadmap for SMARC and Qseven
will fully support the SMARC 2.0 specification. SMARC 2.0 modules will be available for the entire range of relevant processor technologies—from the Intel® Atom™ processor to various ARM designs.
Congatec continues to support all low-power processors for Qseven 2.1 designs as well.
The essential difference between the two standards is the number of interfaces supported: Qseven provides up to 230 pins, while SMARC 2.0 provides up to 314. SMARC aims to interconnect more complex systems in smaller form factors, whereas Qseven is ideal for thinner, less complex module designs and carrier board designs.
Congatec has played a significant and active role in the development of all standards. For the Qseven and SMARC specifications, Congatec has even acted as the publisher, and is therefore a key technology provider for highly compact SFF designs based on COM modules—a market where Congatec has established itself as an industry leader.
Christian Eder, Marketing Director at congatec, SGET board member, and SMARC specification editor, comments, "By taking the big step from SMARC 1.1 to 2.0, we have succeeded in giving this standard a clear perspective for the future. This major leap has brought new interfaces and eliminated a large number of obsolete features. Although designs based on 1.1 may no longer be compatible with 2.0, users are compensated by numerous new features.".
The COM Express 3.0 roadmap
will primarily offer a new pinout, specific to COM modules. Intel® Xeon® and Intel Core™ server processors, as well as AMD Embedded R-series processors, are the primary targets, with ARM-based platforms another possible option.
"All the new specifications provide developers with support for the latest interfaces and many improved features. Alongside the new SMARC 2.0 for highly compact multifunction systems, the new COM Express pin assignment for server modules (SOMs) is particularly innovative. It allows us to target new markets for decentralized, real-time, cutting-edge servers used in media streaming, as well as IoT, M2M, medical, and automation applications," explains Martin Danzer, Product Manager at congatec.
With congatec's personal integration service, developers will find it easy to integrate new revisions into future system designs. Since most features are backward compatible, it is possible in many cases to upgrade existing carrier boards with new modules. This provides investment protection for original equipment manufacturers (OEMs) with existing system designs.
