According to Tim Ruff, Molex's senior vice president, the acquisition allows Molex to offer a broader range of fully integrated solutions to its customers worldwide. He stated, “We are excited about the extraordinary capabilities and technologies that the ISI team brings to the table. ISI's proven expertise in high-density chip packaging strengthens our platform for growth in existing markets while opening doors to new opportunities.”
 
Headquartered in Camarillo, California, ISI provides packaging and interconnect solutions to leading original equipment manufacturers (OEMs) in technology markets, including aerospace and military, industrial, data storage, networking and telecommunications, and high-performance computing. ISI utilizes multidisciplinary and customized strategies to improve solution performance, reduce package size, and accelerate time to market for its customers.
 
“We are excited to join forces with Molex. By combining the strengths of each company and leveraging their manufacturing facilities around the world, we can offer our customers more efficiently and effectively state-of-the-art technology platforms and excellent technical service, as well as increase mass production,” summarizes Bill Miller, president of ISI.