VisionXP+ Vac: The 2-in-1 solution for reflow convection soldering.
The VisionXP+ convection soldering system combines various improvements, primarily aimed at optimizing energy efficiency and reducing emissions. With this device, customers can save up to 20% on energy consumption in electronics production and reduce CO2 emissions by an average of 10 tons per year. The vacuum option enables, for the first time, convection soldering processes with or without vacuum – all in one system! The VisionXP+ Vac reliably eliminates gas bubbles and solder voids during soldering, while the lead wire is still optimally melted. With a vacuum of up to 2 mbar, solder void rates of less than 2% can be achieved.
ViCON: Easy Device Operation and Optimal Process Monitoring.
In the area of intelligent data and network connectivity, Rehm presents the new ViCON software with a touchscreen user interface. The German machine manufacturer developed this innovative solution to facilitate the operation of the VisionX series and achieve optimal monitoring. The software can, for example, log all changing values, save alarms, and statistically analyze them to prevent errors and optimize machine settings.
CondensoXC: High performance for superior reflow soldering.
In reflow soldering with the CondensoX series, soldering is performed using hot steam and the Galden® medium. Since heat transfer is up to ten times greater than in conventional convection soldering, large, high-density boards can be processed without issue. The use of the injection principle and precise temperature and pressure control ensure accurate and varied reflow profiling. At the trade fair, Rehm is presenting the new CondensoXC. This powerful system from the CondensoX series is compact and ideal for laboratories, small-batch production, or prototyping. Void-free soldering can be achieved seamlessly in all systems with the vacuum option.
