The new YRi-V HS configuration is designed for electronics manufacturers across all market sectors, from consumer electronics to industrial and automotive, seeking higher inspection resolution with high production throughput. As circuit designers increasingly adopt components with tiny size features to deliver added functionality and meet stringent overall form factor constraints, manufacturers need higher-resolution inspection systems to ensure proper quality control. Maintaining high throughput is also critical to meeting productivity targets.
The YRi-V HS now combines high inspection resolution and high throughput to handle components such as the latest, smallest SMD chips and integrated circuit packages with fine-pitch I/O. With its square, enlarged field of view (FOV) and 25-megapixel camera, the YRi-V HS can image an entire assembly or a selected area up to 1.6 times faster than standard high-resolution systems.
Furthermore, the new YRi-V HS integrates an advanced laser system for precise height measurement and coplanarity verification of components such as LEDs in lighting products. Laser profiling overcomes the imaging challenges presented by transparent or opaque LED lenses, providing effective quality control so manufacturers can capitalize on LED lighting opportunities in the automotive, consumer, and industrial markets. Laser profiling also enables accurate imaging of components with highly reflective surfaces, such as wafer-level chip packages, helping to increase end-of-line throughput and minimize rework.
