Power supplies designed for demanding applications in the military, industrial, telecommunications, and other markets requiring fanless and/or noiseless operation in confined spaces.
 
The new conduction-cooled MicroPAC power systems incorporate VI Chip® BCM® bus converters and are ideal for distributed power architectures, delivering up to 1300 W of continuous power with up to 92% efficiency and a power density of 25 W/cubic inch in a compact 101.6 x 43.7 x 189.2 mm form factor. Supporting a universal AC input range (85–264 VAC) and offering semi-regulated output voltages of 12, 14, 24, 28, 36, and 48 VDC via four isolated, factory-configurable outputs, the new Westcor conduction-cooled MicroPACs cover a wide variety of custom power requirements. These systems also feature optional eco-mode operation, which powers each output according to its needs, thus improving power efficiency.
 
System designers seeking the flexibility of multiple voltage outputs, rather than using two separate power supplies, can configure MicroPACs with a combination of four high-performance BCM high-voltage bus converters. These can be factory-configured as single, parallel, or series outputs with integrated current sharing. For applications requiring higher power levels, MicroPACs can be configured in arrays of up to several kW with current sharing between units.
 
The conduction-cooled MicroPAC power system offers a baseboard operating temperature range of -40°C to +65°C. The power supply shroud (motherboard) is designed to connect to the heat sink surfaces, thus eliminating the need for fans or forced air cooling, and allowing system designers to use airtight enclosures as protection against moisture and particle ingress.

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