THERM-A-FORM CIP 60 does not require pre-mixing or weighing of components.
The product is suitable as a thermal filler material in applications that require heat transfer in difficult or irregular geometries, such as cooling components of various heights on a printed circuit board (PCB) without applying excessive force.
THERM-A-FORM CIP 60 resists buckling during curing, a process that takes 60 minutes at 110°C or 24 hours at 25°C. At full cure, the product has a Shore hardness of 50 (according to ASTM test method 2240) and can function in temperatures from -50°C to +200°C.
Offering a combination of high thermal conductivity, flexibility, and ease of use, applications for this RoHS-compliant product include: automotive electric mobility systems such as converters and inverters; automotive infotainment systems such as panel displays, HUD (head-up display) units, and audio equipment; automotive ADAS (advanced driver assistance systems) encompassing DCU (domain control units), camera systems, and radar/LiDAR systems; and SSD (solid-state drives) for consumers and businesses.
The THERM-A-FORM CIP 60 formula offers advantages to modern high-performance, high-reliability electronics with properties including: dielectric strength of 125 kVac/mm (ASTM D149 test method); 1013 Ωcm volume resistivity (ASTM D257); 69.3 dielectric constant at 1000 KHz (ASTM D150); and dissipation factor of 0.006 at 1000 kHz (CHO-TM-TP13).
THERM-A-FORM CIP is available in ready-to-use two-component cartridge systems (50, 200 and 400 cc) that eliminate the need to weigh, mix and degas.
