With a typical thermal conductivity of 8.0 W/mK according to the ASTM D5470 test method, THERM-A-GAP™ PAD 80LO is a compressible thermal elastomer for conducting heat through the gaps between a heat-generating surface, such as a semiconductor or battery, and a heat-dissipating surface.
With a hardness of 60 Shore 00 (ASTM D2240), the product exhibits high levels of stress relaxation, with a nearly 90% reduction in compressive strength after just one hour. Parker Chomerics designed THERM-A-GAP™ PAD 80LO to minimize stress on components such as integrated circuits and provide physical protection, such as vibration damping, while maintaining effective thermal contact at all points where gap conformability or rough surface texture is a concern.
Applications that benefit from this include GPUs, CPUs, memory modules, and other high-performance computing equipment, as well as 5G and telecommunications systems. Automotive sensors and devices, energy storage and battery modules, and defense electronics can also benefit from the attributes of the THERM-A-GAP™ PAD 80LO.
The new RoHS-compliant thermal pad features a high-adhesion surface that reduces contact resistance, an operating temperature range of -50 to 200°C, and a UL 94 V-0 flammability rating. The THERM-A-GAP™ PAD 80LO also provides electrical insulation. Electrical properties include: dielectric strength of 8 kVac/mm (ASTM D149); volume resistivity of 10¹³ Ωcm (ASTM D257); dielectric constant of 0.05 at 1000 kHz/2.0 mm thickness (ASTM D150); and a dissipation factor of 0.05 at 1000 kHz/2.0 mm thickness (Chomerics test method).
Parker Chomerics offers THERM-A-GAP™ PAD 80LO in sheets or in custom-sized die-cuts (width and length) with a thickness between 1.0 and 5.0 mm.
