Toshiba Memory Europe GmbH (TME) has begun shipping samples of the industry-leading 128GB Universal Flash Storage (UFS) Ver.3.0 version of embedded flash memory devices. Consumers continue to demand ever-increasing performance and an improved user experience from their devices, and the UFS standard is constantly being refined to support this evolution. Due to its serial interface, UFS supports duplex printing, enabling simultaneous reading and writing between the central processor and the UFS device. With the introduction of UFS 3.0, JEDEC, the world leader in developing standards for the microelectronics industry, has enhanced previous versions of the UFS standard to help product designers enable significant improvements in mobile devices and related applications.
The new devices integrate a 96-layer BiCS FLASH™ 3D flash memory and controller in a standard 11.5 x 13 mm JEDEC package. The controller performs error correction, wear leveling, logical-to-physical address translation, and bad block management for simplified system development.
All three devices support JEDEC UFS Ver. 3.0, including HS-GEAR4, which has a theoretical interface speed of up to 11.6 Gigabits per second per lane (x2 lanes = 23.2 Gbps), while also supporting features that suppress power consumption spikes. The sequential read and write performance of the 512 GB device has been improved by approximately 70 percent and 80 percent, respectively, compared to the previous generation 256 GB Toshiba devices.
Toshiba was the first company to introduce UFS devices and has been releasing them since 2013. The introduction of these UFS Ver. 3.0 devices maintains Toshiba's leading position in next-generation mobile device storage, which will continue to drive new advancements.
