The new line expands Renesas' RX651 MCU group with a 64-pin BGA package (4.5 mm x 4.5 mm) that reduces the footprint by 59 percent compared to the 100-pin LGA, and a 64-pin LQFP package (10 mm x 10 mm) that offers a 49 percent reduction compared to the 100-pin LQFP. These MCUs address advanced security needs for endpoint devices that employ compact sensors and communication modules in industrial, network control, building automation, and smart metering systems operating at the IoT edge.
 
The RX651 MCUs integrate connectivity, Trusted Secure IP (TSIP), and reliable flash area protection, enabling in-field flash firmware updates via secure network communications. The increase in edge endpoint devices has driven the demand for secure over-the-air (OTA) firmware updates. The new RX651 devices support this reprogramming requirement with integrated TSIP, enhanced flash protection, and other technological advancements that offer a more secure and stable solution than other solutions available on the market.
 
Key features of the 64-pin RX651 MCUs
: Enables advanced IoT edge devices: The small 64-pin MCUs with enhanced security features are based on the high-performance RXv2 core and 40nm process, delivering superior performance with a CoreMark® score of 520 at 120 MHz and strong power efficiency with a CoreMark 35/mA score as measured by EEMBC® benchmarks.
 
Easy firmware updates in the field: The integrated dual-bank flash memory allows engineers to achieve high levels of root trust through a combination of TSIP protecting the encryption key; encryption hardware accelerators including AES, 3DES, RSA, SHA, and TRNG; and code flash area protection to safeguard the boot code from reprogramming. The dual-bank flash function supports BGO (Background Operation) and SWAP, making it easy for manufacturers to perform firmware updates in the field safely and reliably.
 
Network connectivity features: Optimized for connected industrial environments, the RX651 MCUs monitor the operating status of machinery both inside and outside the factory, enabling data exchange to change production instructions and reprogram the MCU memory to update equipment configurations.

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