The RA4L1 MCUs employ patented low-power technology that delivers 168 µA/MHz in active mode at 80 MHz and a standby current of only 1.70 µA with all SRAM retained. They are also available in very small packages, including a 3.64 x 4.28 mm wafer-level chip-scale package (WLCSP), which meets the needs of products such as handheld printers, digital cameras, and smart labels.
The RA4L1 MCUs are compatible with Renesas' Flexible Software Package (FSP). The FSP enables faster application development by providing all the necessary infrastructure software, including multiple RTOSs, BSPs, peripheral drivers, middleware, connectivity, networking, and TrustZone support, as well as reference software for building complex AI, motor control, and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOSs with the FSP, thus providing complete flexibility in application development. The FSP facilitates migration of existing IP to and from RA6 or RA2 series devices.
Key features of the RA4L1 MCUs
Core: 80 MHz Arm Cortex-M33 with TrustZone
Memory: 256-512 KB dual-bank Flash, 64 KB SRAM, 8 KB Dataflash
Peripherals: Segment LCD, capacitive touch, USB-FS, CAN FD, low-power UART, SCI, SPI, QSPI, I2C, I3C, SSI, ADC, DAC, comparator, low-power timer, real-time clock.
Packages: 3.64 x 4.28 mm WLCSP72, 7 x 7 mm LQFP48, 10 x 10 mm LQFP64, 14 x 14 mm LQFP100, 5.5 x 5.5 mm BGA64, 7 x 7 mm BGA100
Security: Unique ID, RSIP security engine compatible with TRNG, AES, ECC, Hash
Wide ambient temperature range: Ta = -40º to +125º C for QFN, QFP and CSP package options; Ta = -40º to +105º C for BGA package option.
