Advanced process technology also offers the possibility of integrating a rich set of features, including functions such as RF. Furthermore, the advanced process node utilizes a smaller chip area for the same functionality, resulting in smaller chips with greater integration of peripherals and memory.

The first chip manufactured on the new 22 nm process is an extension of Renesas' popular RA family of 32-bit Arm® Cortex®-M microcontrollers. This new wireless MCU offers Bluetooth® 5.3 Low Energy (LE) with integrated software-defined radio (SDR). It provides a future-proof solution for customers building products with a long lifecycle. Whether during development or after deployment, devices can be updated with new application software or new Bluetooth features to ensure compliance with the latest specification versions.
End-product manufacturers can leverage all the features of previous versions of the Bluetooth LE specification. Whether designing devices for radio direction finding applications using Bluetooth 5.1's angle of arrival (AoA)/angle of departure (AoD) features, or adding low-power stereo audio transmission to products using Bluetooth 5.2 isochronous channels, developers now need only one device that supports all these features.

Renesas
is already offering samples of the new device to selected customers, with a planned market launch in the fourth quarter of 2023. Customers interested in testing the new device can contact their local Renesas sales office. 

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