With 128 KB and 256 KB flash options and 40 KB of SRAM, the new clusters integrate a wealth of connectivity options, including on-chip CAN FD, USB, QSPI, SSI, and I3C interfaces, and offer a simple upgrade path to other members of the RA family. They are ideal for applications requiring high performance in small packages, such as sensing, gaming, wearables, and home appliances.
The RA4E2 and RA6E2 are the most cost-effective members of the RA family with integrated CAN FD and are available in small package options, including a 36-pin, 4 x 4 mm BGA and a 32-pin, 5 x 5 mm QFN, to meet the needs of cost-sensitive and space-constrained applications. Furthermore, the new devices' low power consumption saves energy, enabling the final products to contribute to a greener environment.
All RA devices are compatible with Renesas' Flexible Software Package (FSP), which includes powerful drivers and middleware to facilitate communication implementation and enhance peripheral functionality. The FSP's graphical user interface simplifies and accelerates the development process. It allows for flexible use of legacy code, as well as easy compatibility and scalability with other devices in the RA family. Designers using FSP also have access to the entire Arm ecosystem, as well as Renesas' extensive partner network, which offers a wide range of tools to help accelerate time to market.
The RA4E2 includes five different options, ranging from 32-pin to 64-pin packages as small as 4 x 4 mm, and 128 kB of flash memory along with 40 kB of SRAM. The RA4E2 devices offer excellent active power consumption, using 82 µA/MHz while running from 100 MHz Flash. They have an extended operating temperature range of -40/105°C. The RA4E2 group is ideal for cost-sensitive applications and other systems requiring an optimal combination of performance, low power consumption, and small package size.
MCU Group
Key features of the RA4E2 group:
100 MHz Arm Cortex-M33 CPU core;
128 KB integrated Flash memory; 40 KB of RAM.
Compatible with a wide temperature range Ta = -40/105°C.
Package options from 32 to 64 pins.
Low power operation: 82 µA/MHz in active mode while running at 100 MHz.
Integrated communication options including USB 2.0 Full-Speed ​​Device, SCI, SPI, I3C, HDMI CEC, SSI, and CAN FD.
Reduced system costs with internal oscillator, abundant GPIO, advanced analog, low-voltage detection, and internal reset function.
RA6E2 MCU Group.
RA6E2 group MCUs offer 200 MHz performance. The group includes 10 different pieces, ranging from 32- to 64-pin packages as small as 4 mm x 4 mm, and from 128 KB to 256 KB of flash memory along with 40 KB of SRAM. The RA6E2 devices offer exceptional power consumption specifications, as well as extensive peripheral and connectivity options, delivering a unique combination of performance and features.
Key features of the RA6E2 group:
200 MHz Arm Cortex-M33 CPU core;
Integrated flash memory options from 128 kB to 256 kB; and 40 kB of RAM;
32-pin to 64-pin package options;
Low power operation: 80 µA/MHz in active mode while running at 200 MHz;
Integrated communication options including USB 2.0 Full-Speed ​​Device, SCI, SPI, I3C, HDMI CEC, SSI, QSPI, and CAN FD;
Integrated timer
; Advanced analog