In this way, the new series opens up new growth opportunities and positions itself as the ideal choice for fast-start applications in areas such as security, industry, and IoT.
The GD5F1GM9 series' high-speed QSPI NAND Flash is manufactured using a 24nm process. The series supports both 3V and 1.8V operating voltages and offers various high-speed read modes: Continuous Read, Cache Read, and Auto Next Page Load. The newly added Continuous Read and Auto Next Page Load modes provide users with greater versatility for quickly accessing code and data. Furthermore, a novel parallel computing system is incorporated into its ECC (Error Correction Code) design, replacing the traditional serial method and significantly reducing the processing time of the integrated ECC.
In terms of performance, the 3V version of the series achieves speeds of up to 83 MB/s in Continuous Read mode with a maximum frequency of 166 MHz, while the 1.8V version reaches 66 MB/s at 133 MHz. These figures, which are up to three times faster than conventional SPI NAND products operating at the same frequency, allow for improved data access, reduced system boot time, and lower overall power consumption.

The existence of factory-defective blocks is an inherent problem with NAND Flash technology. To counteract this, the GD5F1GM9 series incorporates Bad Block Management (BBM). This feature ensures that the entire memory array can be accessed with a single command, as BBM dynamically maps the addresses of defective blocks to valid blocks, automatically skipping those that are faulty. The first 256 blocks of the GD5F1GM9 series are guaranteed to be fully functional out of the box. Although factory-defective blocks may exist, and new defective blocks may appear during use, the BBM function creates links between logical and physical addresses, allowing for the redistribution and replacement of problematic blocks. The device supports up to 20 lookup links in the BBM table.
The GD5F1GM9 series offers a capacity of 1 Gb, with two operating options at 3 V and 1.8 V. It is available in multiple package formats, including 8 × 6 mm WSON8, 6 × 5 mm WSON8, and BGA24 with a 5 × 5 ball array.

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