These modules are designed for applications that demand exceptional multi-core and multi-threaded performance, large caches, huge memory capacities, high bandwidth, and advanced I/O technologies.
The intended applications include medical imaging, testing and measurement, communications and networking, retail, energy, and banking. Other use cases include video surveillance for traffic monitoring, as well as automation applications such as optical inspection, which also benefit from the module's improved performance.
The new conga-HPC/cBLS COM-HPC Client Size C modules are ideally suited for high-performance, real-time applications with workload consolidation. The hypervisor integrated into the module's firmware provides direct access to the benefits of system consolidation. The module offers a cost-effective alternative to traditional motherboards, particularly for applications that consistently demand peak performance and therefore require frequent upgrades. Compared to motherboards, standardized COM modules offer superior scalability and a straightforward upgrade path through simple module swapping, even across processor generations. No fundamental design changes are necessary.
“The heterogeneous computing architecture, featuring powerful Intel® graphics and Deep Learning Boost, transforms the module into a high-performance, low-power server capable of performing AI inference for power-intensive edge applications. When used as a GPGPU, it offers a unique price-performance ratio.” “Compatibility with Intel® TSN and TCC provides an ideal foundation for networked, real-time applications in sectors such as medical technology, automation, and industrial solutions,” explains Jürgen Jungbauer, Senior Product Line Manager at congatec.
Ready for applications and available as Hypervisor-on-Modules,
the new congatec conga-HPC/cBLS COM modules offer up to 42 PCIe lanes, including 16 lanes with PCIe Gen 5 and up to 12 lanes with PCIe Gen 4. Integrated Intel® graphics, with up to 32 execution units, deliver impressive AI inference performance for edge AI applications. Fast DDR5-4000 memory with ECC support is available for data-critical applications.
The new C-size COM-HPC Client modules are also available as application-ready and custom-configured aReady.COM modules, including pre-installed and licensed validated operating systems such as ctrlX OS, Ubuntu, and/or RT-Linux. Optional features include system consolidation with aReady.VT and IoT connectivity. To further accelerate time to market, the modules can be preloaded with the client application, allowing users to simply plug them into their finished systems. With the Hypervisor-on-Modules integrated into the firmware, the COM modules offer a highly cost-effective and flexible solution for system designs, replacing multiple systems in various use cases. Examples include test and measurement systems for visualization, real-time control of production cells with HMIs and IoT gateways, and edge servers in smart grids.
Furthermore, congatec's high-performance ecosystem and design services simplify application development. The service portfolio includes comprehensive board support packages, evaluation and production-ready application carrier boards, custom cooling solutions, extensive documentation and training, and high-speed signal integrity measurements. Application developers can also install the new COM-HPC modules on congatec's Micro-ATX application carrier board (conga-HPC/mATX) for COM-HPC client modules. This provides immediate access to all the benefits and enhancements of the new modules, including ultrafast PCIe connectivity.
More information about the new conga-HPC/cBLS modules
