The modules based on the Intel Core i7-14700 processor stand out with four additional E-Cores compared to the Intel Core i7-13700E variants, providing a further performance boost with a total of 20 cores. Another new feature is the improved bandwidth of USB 3.2 Gen 2x2, reaching speeds of up to 20 gigabits per second.
"The new conga-HPC/cRLS COM modules represent one of the highest performance levels available in COM-HPC Client Size C and are chipset compatible with existing Raptor Lake-S based modules. This means they can immediately provide existing designs with even more power," explains Jürgen Jungbauer, Senior Product Line Manager at congatec. "Suitable heatsinks are also available to maximize performance, allowing developers to find everything they need for integration into their dedicated systems within our high-performance ecosystem.".
The COM-HPC Size C form factor (120 mm x 160 mm) targets application areas requiring exceptional multi-core and multi-threaded performance, large caches, massive memory capacities combined with high bandwidth, and advanced I/O technology. These include, for example, high-performance artificial intelligence (AI) and machine learning applications. Also included are all embedded and edge computing solutions with workload consolidation, for which congatec offers real-time hypervisor technology pre-configured in the module's firmware. Target markets for the new congatec COM HPC Size C modules include industrial automation and medical technology, as well as edge and network infrastructure applications. All of these benefit from the optimized compute cores of this hybrid performance architecture, which currently supports up to 8 performance cores and 16 efficiency cores.
The new COM conga-HPC/cRLS modules in COM-HPC Size C form factor are available in the following variants. All variants of the Intel Core 14xxx series are new.
Application engineers can deploy the new COM-HPC modules on the congatec Application Carrier Board Micro-ATX (conga-HPC/uATX) for COM-HPC Client type modules to instantly capitalize on all the advantages and improvements of these modules in combination with ultra-fast PCIe Gen5 connectivity.
