Utilizing a system-on-a-chip architecture, TI incorporates accelerated vision and AI processing, real-time control, and functional safety capabilities into its TDA4VM processor. This Dual Arm Cortex-A72-based module is designed for industrial mobile machinery requiring near-field analysis, such as automated guided vehicles and autonomous mobile robots, as well as construction and agricultural equipment. Other application areas include any vision-centric industrial or medical solution requiring powerful yet low-power AI processors at the edge. Integrating the powerful TI TDA4VM processor into a standardized COM module simplifies the design process for this powerful processor technology, allowing designers across various embedded industries to focus on their core competencies. This is advantageous because companies save on upfront costs and shorten time to market compared to fully customized designs, especially if they are producing smaller quantities of their solutions.

“Collaborating with a COM module provider like congatec on their application-ready modules is a key benefit for engineers working with our Arm Cortex-based processors like the TDA4VM. Industrial OEMs, especially those without the resources to invest in fully custom designs, can benefit from the innovative SMARC COMs that help streamline design while enabling high design security and low NRE costs,” said Srik Gurrapu, Director of the Industrial Division, Processors, Texas Instruments.

“We see AI- and computer vision-based autonomous driving as one of the most important markets for embedded and edge technologies, alongside the second major growth accelerator of digitalization. TI offers highly integrated processors for these types of applications, and we are confident that our value-added approach to COM modules will open new markets for this type of high-performance, AI-based, server-grade edge technology. TI processors will be available in our credit-card-sized SMARC COM module ecosystem with all the added value. This includes rapid prototyping and application development, cost-effective motherboard designs, and ultra-reliable resources, with responsiveness and performance from design to OEM serial production,” explains Martin Danzer, Director of Product Management at congatec.

Congatec unveiled this new portfolio, highlighting the upcoming SMARC module with a TI TDA4VM processor. The first prototypes are expected to be available by mid-2023, with serial production planned for 2024. TI processors will be an integral part of congatec's Arm technology roadmap. As a result, congatec's ecosystem of high-performance COM modules will be highly scalable and cover major performance levels.

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