The new conga-HPC/cRLS COM modules in COM-HPC Size C (120x160mm) form factor target application areas that demand exceptionally high multi-core and multi-threaded performance, large caches, and massive memory capacities combined with high bandwidth and advanced I/O technology. The target markets include performance-driven industrial, medical, and edge applications utilizing artificial intelligence (AI) and machine learning (ML), as well as all types of embedded and edge system solutions with workload consolidation requirements, for which congatec also supports Real-Time Systems' hypervisor technologies.
“With up to 8 performance cores currently running in parallel to 16 efficient cores, the socketed variants of 13th Gen Intel Core processors enhance our HPC COM modules to offer even more options for making edge computing more powerful and efficient through workload consolidation,” explains Jürgen Jungbauer, Senior Product Line Manager at congatec. IoT-connected systems have many tasks to process in parallel, and if OEMs don’t want to implement this connectivity through adaptive systems, they need to integrate virtual machines into their solutions. The more cores a COM module provides, the easier this becomes.
Features:
The most notable improvement in the 13th Gen Intel Core processors with sockets is the increase of up to 34% in multithreaded performance and up to 4% in single-threaded performance[1], as well as an impressive 25% performance boost in image classification inference[1], compared to 12th Gen Intel Core processors. Added support for DDR5-5600 and increased L2 and L3 cache in select variants contribute to even more outstanding multithreaded performance. The compute core enhancements in this high-performance hybrid architecture, which currently provides up to 8 Performance Cores and 16 Efficiency Cores, are complemented by improved USB 3.2 Gen 2x2 bandwidth of up to 20 Gigabits per second in the new congatec COM-HPC Size C modules.
The new congatec COM-HPC/cRLS module in COM-HPC Size C form factor will be available in the following variants:
Application engineers can deploy the new COM-HPC modules on the congatec Micro-ATX Application Carrier Board (conga-HPC/mATX) for Client-type COM-HPC modules to instantly capitalize on all the benefits and improvements of these new modules in combination with ultra-fast PCIe connectivity.
