The RA6M3 AI/ML and RA4E1 AI/ML Reference Kits , available from Mouser, are designed to address the engineering and product development challenges commonly faced by system designers. Each kit offers multiple interfaces to function as a central node for collecting data from various sensors for real-time vision-based analytics, audio, or AI/ML applications. The RA6M3 Reference Kit features six Pmod connectors, and the RA4E1 kit has three. Both kits include CAN FD, USB Type-C™, a Segger J-Link® debug port, and a parallel camera port. The RA6M3 kit also adds a camera module and an Ethernet port for additional connectivity. An integrated MEMS tracking device with a built-in temperature sensor and two MEMS microphones enables positioning and audio recognition applications. A resistive touch TFT module provides a human-machine interface (HMI) and is used in application examples. The AI/ML development kits are fully compatible with the Renesas Flexible Software Package (FSP) and are supported by the Reality AI Software with real-time analytics capabilities and the Renesas Ready Partner Network for specific use cases. The kits include sample applications to help new users get started, and the available ecosystem and AI/ML software enable them to develop their own solutions.
SYSGO and Kontron launch BSP for PikeOS on the VX3060
SYSGO, a provider of real-time operating systems and hypervisors for security- and safety-critical embedded applications, and Kontron, a global provider of IoT and embedded systems (ECT) technology, have announced the availability of a board support package (BSP)...
