The board can be flexibly scaled with congatec's latest high-end COM-HPC server modules. Together with the updated modules, which are equipped with the latest Intel Xeon D-1800 and D-2800 processors, customers receive a ready-to-use µATX platform for high-performance applications in a robust, space-saving design.
With the new µATX motherboard for COM-HPC server modules, congatec reinforces its commitment as a provider of advanced computing solutions for immediate use in demanding industrial applications.

The ecosystem of COM-HPC modules and µATX motherboards offers original equipment manufacturers (OEMs) a wide range of customization options at the module, board, and system levels, allowing developers to freely choose according to their needs. The ecosystem package is tailored to the stringent requirements of edge computing and provides powerful, reliable, and ready-to-use building blocks for industrial environments. The modular approach shortens time to market for new designs and future-proofs them.

The new conga-HPC/uATX server motherboard offers I/O and expansion options in a compact, standard form factor. This makes it an ideal solution for numerous applications, such as server consolidation for virtual machines (VMs) or edge servers for microgrids, video processing, facial recognition, security applications, smart city infrastructure, and many others. The conga-HPC/uATX server offers multiple features to power such applications, including robust communication options with up to 100 GbE bandwidth, PCIe x8 and x16 expansion for processing AI-intensive workloads via GPGPUs or other compute accelerators, two M.2 Key M slots for NVMe SSDs, and one M.2 Key B slot for compact AI accelerators or communication modules for Wi-Fi or LTE/5G.

The new conga-HPC/sILL and conga-HPC/sILH server modules leverage the latest Intel Ice Lake D-1800 LCC and D-2800 HCC processor series, delivering up to 15% higher performance at the same TDP compared to the previous D-1700/D-2700 series. The improved performance per watt of the COM-HPC modules is ideal for high-performance applications that were previously limited by their thermal constraints. They also benefit from Intel Speed ​​Select Technology, which makes it easier to balance computing performance with the maximum TDP of the system design. The latest processors have up to 22 cores with higher clock speeds to support next-generation edge applications with more performance per watt for more energy-efficient and therefore more reliable designs. Scalable edge performance and a modular approach increase the flexibility and future-proofing of designs, reduce total cost of ownership, and shorten time to market.

The new COM-HPC server modules impress with their firmware-integrated hypervisor, which simplifies the evaluation of server consolidation with virtual machines. They also boast full real-time capabilities, provided by TCC, TCN, and optional SyncE support. This is particularly well-suited for all 5G network solutions requiring very low latency and strict frequency/clock synchronization.

For the new COM-HPC server module platform based on the µATX solution, congatec also offers several comprehensive cooling solutions, including passive cooling for small chassis. In addition to customizing the conga-HPC/uATX server motherboard, the service package also includes customer-specific BIOS/UEFI and real-time hypervisor implementations, as well as expansion with additional IIoT functionalities for digitization purposes.

You can find more information about the new conga-HPC/uATX server motherboard here and the latest congatec SOM modules here.