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- Category: Other Semiconductors
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- Category: Current Affairs
Sumitomo Heavy Industries, Ltd. (SHI) is taking a further step in its semiconductor growth strategy by renaming two group companies under a unified identity called “Material Solutions”, including one located in France.
This move marks the next phase of SHI's long-term commitment to the global semiconductor industry, bringing together its ion implantation, laser annealing, and advanced materials engineering capabilities into a more coherent, customer-centric structure.
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- Category: Integrated Circuits
Melexis introduces the MLX90296, a new micropower linear Hall effect sensor that consumes less than 5 µA at 100 Hz and integrates digital filters for enhanced performance. Its flexible architecture is available in multiple pre-configured variants with different part numbers, enabling short lead times and making it suitable for a wide range of battery-powered applications, such as keyboards, game controllers, long linear races, and more.
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- Category: Current Affairs
AI-enabled centralized automation, predictive maintenance, and advanced building and energy automation solutions will make next-generation semiconductor manufacturing more efficient, safe, and reliable.
The agreement focuses on critical infrastructure for semiconductor manufacturing, as well as broader applications of artificial intelligence, robotics, and connectivity.
Siemens and GlobalFoundries (GF) have launched a new strategic collaboration to leverage each company's complementary AI capabilities and improve the performance of semiconductor manufacturing and other advanced industries by increasing the efficiency, safety, and reliability of operations. In their new memorandum of understanding, the companies focus on chip manufacturing automation technologies (fab automation), electrification, digital solutions, and software, encompassing everything from chip development to product lifecycle management.
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- Category: Integrated Circuits
Melexis announces a new model of the MLX90514, a dual-input inductive sensor interface designed for robotic, industrial, and mobility applications. Through its SSI output protocol, it provides absolute positioning with high noise immunity. Applications include robotic joint control, industrial motor switching, and electric mobility propulsion systems
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- Category: Other Semiconductors
Nordic Semiconductor announces the launch of the nRF54LV10A SoC, setting a new standard in integration, performance, and battery life for the smallest medical devices. Designed specifically for low-voltage, space-constrained Bluetooth® LE applications, the nRF54LV10A can be powered directly by a silver oxide battery, making it ideal for wearable biosensors, continuous glucose monitors (CGMs), and other healthcare applications.
Addressing the demand for connected health
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- Category: Embedded Systems
Nordic Semiconductor announces the availability of the nRF7002 Expansion Board II (nRF7002 EBII). The nRF7002 EBII adds Wi-Fi 6 capabilities to Nordic's nRF54L series development kits (DKs), enabling developers to create high-performance, low-power IoT solutions with integrated Wi-Fi 6.
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- Category: Technology
Drawing inspiration from human vision, a European research project led by VTT has developed artificial vision that mimics the cooperation between the eye and the nervous system, implemented as edge computing circuits. Edge computing involves processing data where it is generated and where the results are needed. This enables, for example, intelligent robots and drones capable of operating independently in rescue missions after an earthquake without constant network connections or bulky batteries.
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- Category: Microcontrollers
Renesas Electronics Corporation has introduced the RA6W1 dual-band Wi-Fi 6 wireless microcontroller (MCU), along with the RA6W2 MCU, which integrates Wi-Fi 6 and Bluetooth® Low Energy (LE) technologies. These connectivity devices address the growing demand for always-connected, ultra-low-power IoT equipment in smart home, industrial, medical, and consumer applications. Renesas also launched fully integrated modules that accelerate development thanks to built-in antennas, wireless protocol stacks, and pre-validated RF connectivity.
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- Category: Embedded Systems
Tria Technologies has introduced two new Qseven (Q7) COM (Computer-on-Modules) modules that guarantee the viability of Q7 designs until at least 2034, with an optional extension to 2039. The new modules, TRIA-Q7-ASL and TRIA-Q7-ALN, are based on the well-established Q7 standard and provide a substantial performance boost along with a guaranteed product lifespan extension, making Q7 a reliable choice for long-term projects.
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- Category: Thermal control
Chomerics Division of Parker Hannifin Corporation introduces THERM-A-GAP™ PAD 10, a series of thermal conductivity filler pads for applications where high performance and ultra-low Shore hardness are the primary material requirements.
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- Category: Software
IAR has announced new enhancements to its development toolchain for the Renesas RH850 microcontrollers (MCUs). The RH850 architecture, widely adopted in automotive applications, now incorporates modern development capabilities within IAR's embedded development platform, including cloud-enabled licensing, container support, and CI/CD integration.
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