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- Category: Sensors
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- Category: Other Semiconductors
ROHM has begun mass production of the SCT40xxDLL series of SiC MOSFETs in TOLL (TO-Leadless) packages. Compared to conventional TO-263-7L packages with equivalent rated voltages and on-resistance, these new packages offer approximately 39% improved thermal performance.
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- Category: Liabilities
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- Category: Integrated Circuits
Battery-powered devices and energy-constrained applications must control and monitor power consumption without wasting energy. To address this challenge, Microchip Technology today announced two digital power supervisors that consume half the power of similar solutions under typical operating conditions at 1024 samples per second.
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- Category: Test and Measurement Equipment
Spectrum Instrumentation introduces its new Arbitrary Waveform Generators (AWGs) with up to 6 channels at 10 GS/s or 12 channels with an output speed of 5 GS/s. The new AWG DN6.63x belong to the company's Netbox series, a line of user-friendly instruments that can be controlled via Ethernet cable from any PC or network.
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- Category: Current Affairs
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- Category: Assets
LEMO announces the launch of the REDEL SP IP68 series, the next generation of high-performance connectors designed for medical, test, measurement, and unmanned aerial vehicle (UAV) applications. LEMO takes high-performance connectivity to the next level with innovative resin-free IP68 sealing.
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- Category: Current Affairs
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- Category: Seminars
Mouser Electronics, Inc. announces the release of a new e-book in collaboration with the YAGEO Group. In Powering the New Automotive Era with Smart Passive Solutions, industry experts explore how passive electronic components are evolving to meet the demands of increasingly electrified automotive systems.
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- Category: Liabilities
Murata Manufacturing Co., Ltd. announces the launch and mass production of its multilayer ceramic capacitor (MLCC) with a capacitance of 15nF, a voltage rating of 1.25kV, and C0G characteristics in a compact 3225M (3.2mm x 2.5mm / 1210in) size. This product offers efficient power conversion and stable performance under high-voltage conditions, making it suitable for on-board chargers (OBCs) in electric vehicles (EVs) and power supply circuits in high-performance consumer devices.
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- Category: Embedded Systems
Tria Technologies has introduced the TRIA SM2S-IQ615 and TRIA OSM-LF-IQ-615 modules, which incorporate a Qualcomm Dragonwing™ IQ-615 processor. These modules deliver AI-ready, industry-grade performance along with powerful developer peripheral support, enabling engineers and developers to push the boundaries of edge AI.
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- Category: Software
The increasing complexity of industrial automation systems, coupled with the need for scalability, cybersecurity, and edge-to-cloud integration, has driven demand for unified software platforms. EXOR International addresses this challenge with X Platform, a multi-technology, multi-device software ecosystem designed to standardize and accelerate the development of industrial human-machine interfaces (HMIs), edge computing, and Industry 4.0 solutions.
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