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- Category: Current Affairs
Vertiv Holdings Co. has announced the completion of its previously announced acquisition of Purge Rite Intermediate LLC (“PurgeRite”), a leading provider of mechanical flushing, purging, and filtration services for data centers and other mission-critical facilities. This transaction, valued at approximately $1 billion, expands and strengthens Vertiv’s thermal management services offering, solidifying its position as a global leader in next-generation liquid cooling services.
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- Category: Integrated Circuits
Toshiba Electronics Europe GmbH (“Toshiba”) introduces the TCR5FM series of 35 LDO regulators, which help stabilize the DC power line for small devices such as smartphones and wearables. LDO regulators help address the challenge engineers face when designing battery-powered devices to switch from low-power mode to high-speed processing, thereby maximizing performance and battery life.
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- Category: Integrated Circuits
Toshiba Electronics Europe GmbH (“Toshiba”) announces the shipment of commercial samples of its innovative door driver integrated circuit, the TB9084FTG, specifically designed for three-phase brushless DC (BLDC) motors. These motors are indispensable for a variety of essential onboard functions in diverse automotive applications, including body systems such as power sliding doors, power tailgates, and power seats, as well as electric pumps, fans, and motor generators.
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- Category: Current Affairs
Rutronik Elektronische Bauelemente GmbH and ROHM Semiconductor proudly celebrate 30 years of successful collaboration, marking a milestone in a long-standing partnership that has significantly influenced the electronics distribution landscape in Europe.
Founded in 1973 and owner-operated from Ispringen in southern Germany, Rutronik has become one of Europe's leading distributors of electronic components.
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- Category: Other Components
Taoglas® has announced the expansion of its embedded antenna portfolio with a new range of low-temperature baked ceramic chip (LTCC) antennas optimized for Wi-Fi® 6/7, ultra-wideband (UWB), and ISM connectivity. The new ILA.257, ILA.68, and ILA.89 offer exceptional performance in ultra-compact packages with minimal exclusion areas, designed for next-generation IoT, consumer, industrial, and wearable applications.
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- Category: Design
This is part 2 of a two-part series. Part 1 covered PCB design with high-precision 50 Ω transmission lines and minimizing impedance discontinuities at connector transitions to reduce return loss. Part 2 addresses isolation between transmission lines, how isolation affects beamformer IC performance, and how to choose the correct line topology for a given isolation requirement.
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- Category: Design
This is the first part of a two-part series. Part one discusses PCB design with high-precision 50 Ω transmission lines and minimizing impedance discontinuities at connector transitions to reduce return loss. Part two will examine isolation between transmission lines, how isolation affects beamformer IC performance, and how to select the correct line topology for a given isolation requirement.
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- Category: Current Affairs
Security, connectivity, and regulatory compliance are the cornerstones of the joint strategy of Kontron and congatec, presented at the SPS 2025 trade fair in Nuremberg. In a context marked by the imminent implementation of the European Cyber Resilience Act (CRA) and the NIS2 directive, both companies are committed to an integrated technology platform that redefines the development and deployment of embedded and industrial systems.
The CRA as a technological catalyst
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- Category: Current Affairs
On November 18, congatec announced a technology collaboration with Qualcomm Technologies, Inc. that will accelerate the commercialization of high-performance, embedded, cutting-edge AI applications for size, power, and weight (SWaP) industrial products based on Qualcomm Dragonwing™ processors. In its first phase, the collaboration allows developers using Qualcomm Dragonwing IQ-X Series processors to leverage the versatility of congatec's ready-to-use COM-HPC Mini Computer-on-Modules range.
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- Category: Assets
Same Sky's Audio Group today announced the expansion of its loudspeaker product portfolio with new receiver models. Ideal for supra-aural applications, the CMR receiver family offers sound pressure levels ranging from 103 to 135 dB measured with an artificial ear, as well as package sizes as small as 12 x 6 mm and profiles as thin as 2 mm.
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Avnet Silica, an Avnet company, today announced its new franchise agreement with DEEPX, a South Korea-based hardware and software manufacturer specializing in highly efficient and powerful artificial intelligence (AI) semiconductor technology.
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- Category: Software
MIKROE has released a new version of its powerful multi-architecture IDE, NECTO. This version offers direct AI assistance for writing embedded code or reviewing complex functions with just a click of the mouse.
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