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- Category: Power Supplies
Monolitic introduces the MPO-100S product family from its represented brand, Micro Power Direct. This series comprises high-performance power supplies in a miniature 4 x 2-inch form factor, combining high density, robustness, and affordability. All models in this series operate with a universal input of 90 to 264 VAC and a single output of 12, 15, 24, and 48 VDC. They comply with EN55022 Class B filtering standards, feature active PFC according to EN61000-3”D”, and offer precise line/load regulation.
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- Category: Other Equipment
Misana Enginyeria, SL is a technology-based company that researches, designs, develops prototypes and manufactures custom electronic equipment, automation, control and communication systems for companies and technology centers.
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- Category: Sensors
With its MLX91207 sensor, Melexis takes another step toward making cars more environmentally friendly by opening up new opportunities for contactless current sensing in Hybrid Electric Vehicles (HEVs) and Electric Vehicles (EVs), as well as in renewable energy applications. The MLX91207 is a fully customer-programmable monolithic IC sensor in a standard SO-8 package. The Hall effect sensor provides a high-speed analog output signal proportional to the applied external flux density. The MLX91207 allows users to create a robust current sensor solution with fast response times. The MLX91207 also features an additional thermometer output.
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- Category: Other Equipment
Garma Electrónica announces the ProducTVity™ productivity station from its distributor Red Lion, a high-performance solution for data collection, recording and visualization.
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- Category: Components
RS Components (RS), a trading brand of Electrocomponents plc, has launched version 3.0 of DesignSpark PCB, the professional PCB design software that it offers free of charge to professional designers, hobbyists, and students.
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- Category: Design
Mouser Electronics, Inc. announces the immediate availability of Android™ Open Accessory development support modules - Microchip Technology's DM240415 Starter Accessory Kit for Android and Arduino's Mega Android Development Kit.
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- Category: Lighting
Power Integrations offers the LinkSwitch-PH LED driver ICs in a small, very low-profile (2 mm) eSIP™-L package. This new package is designed for LED replacement in fluorescent tubes, where small packages are needed to fit the limited space behind the LED circuit board, as well as for other applications where board height is restricted.
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- Category: Lighting
AFEISA presents a new update and improvement to the Teleastro.net system, designed to facilitate better energy management of installations.
These improvements are detailed in the document titled “Teleastro.net: Intelligent Management of Installation Consumption,” which outlines the new features aimed at enabling intelligent use of energy consumption data for lighting installations.
Highlights include monthly statistics and power savings graphs, which intuitively visualize the savings achieved for each installation.
- Details
- Category: Lighting
The TUNELux is a lighting control unit that incorporates a wide-range (0 to 50,000 lux) and high-precision lux sensor, which has 4 output relays to act on 4 lighting circuits, depending on the illuminance level programmed for each of them.
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- Category: Lighting
The Monolit family of outdoor lighting control panels celebrates its third anniversary with more variants, technical improvements, and new features.
A few months ago, the range was expanded with the Monolit Plus, a high-capacity panel, and the entire SmarTower® series of variants was introduced—a new family designed for the design and development of Smart City installations.
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- Category: Thermal control
The evolution of thermal management. The dispensing of in-situ curing gap fillers is expected to become the dominant technique for placing thermal materials in electronic assemblies, as sectors such as automotive electronics, telecommunications equipment, and energy-efficient lighting demand higher production capacity, thinner glue lines, and reduced mechanical stress on components and solder joints. This trend will drive changes in the characteristics and handling of thermal materials, as well as in assembly processes and the equipment used in factories.
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- Category: Integrated Circuits
The current highly competitive market is prompting embedded system designers to re-examine their design and development processes. Increased system complexity and performance demands, coupled with constraints on energy consumption and space, are pushing the boundaries of conventional methods.
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