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- Category: Other Components
Farnell has added three new LED lighting connector designs to its JAE interconnect product range. The agreement between the two companies, which includes a six-month exclusivity period, makes Farnell the first European distributor of the ES3 series.
Offered in three formats—PCB edge (wireless), wire-to-board (wire insertion), and discrete wire—the ES3 series provides an efficient method for interconnecting PCB-mount LEDs with other circuitry in LED module designs. All three connector formats are manufactured from a high-temperature resistant resin and are designed for surface mounting.
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- Category: Lighting
Expanding on the support services it offers to LED lighting manufacturers, which were launched this fall, Cree, Inc. is now introducing two new Cree TEMPO design and evaluation offerings. The new TEMPO (Thermal Electrical Mechanical Photometric Optical) thermal simulation and photometric testing options are designed to remove barriers for LED lighting manufacturers and accelerate widespread adoption of LED lighting.
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- Category: Batteries
Saft unveiled at Intelec 2011, the International Conference on Energy for Telecommunications held in Amsterdam, the new evolution of Lithium-ion technology, which features backup power systems compatible with a wide range of applications for the telecommunications sector including CO (Telephone Exchanges), DPCO (Distributed Power for Telephone Exchanges), MSC (Mobile Connectivity Centers), and BTS (Base Transceiver Stations).
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- Category: Batteries
The GlobTek GS-1907 battery pack consists of three Samsung Li-Ion cells in a 3S-1P configuration and provides 28.86 Wh (2600 mAh) of power for mobile and other applications requiring backup battery with an inexpensive simple charger.
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- Category: Embedded Systems
Imsys has launched a new module within its SNAP (Simple Networld Application Platform) product family. This new module, named Stamp for its small size and resemblance to a postage stamp, includes everything needed to develop networking-enabled products. Compared to developing a device that directly uses the microprocessor, using the Stamp module simplifies PCB development, reducing costs due to streamlined routing, multilayer technology, and EMC issues. Furthermore, and perhaps more importantly, the module eliminates concerns for users regarding component obsolescence, as Imsys handles this, along with firmware updates, ensuring a long product lifespan.
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- Category: Embedded Systems
IEI Technology Corp., distributed in Spain by Tempel, launches the WAFER-CV-N2600x/D2700x. This 3.5-inch motherboard is based on the new Intel Atom N2600 and D2700 processor families. The WAFER-CV-N2600x/D2700x supports resolutions up to 2560 x 1600 with a Chrontel CH7511 DP to LVDS converter. It has an operating temperature range of -20°C to +70°C.
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- Category: Other products
One of the ongoing challenges facing precision analog engineering is improving energy management efficiency while simultaneously deepening both analog and digital integration. As interest in power management integrated circuits grows, more and more engineers are realizing the many similarities between boost and buck switching regulators.
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- Category: Design
Cypress Semiconductor Corp. has introduced the PSoC®3 CapSense® Plus capacitive touch sensing solution for buttons, cursors, touchpads, and proximity sensing. It is the best capacitive sensing solution on the market that can also perform general system control functions. To accomplish this, the new product combines two key elements of Cypress's product portfolio: the PSoC3 programmable system-on-a-chip and the market-leading CapSense capacitive sensing technology.
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- Category: Other Equipment
With an IP65 protection rating and the ability to withstand up to 50 drops from a height of 2 meters, the Sick IDM160 handheld scanner offers maximum durability. Its powerful motor and triple read confirmation ensure exceptional ease of use
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- Category: Electromechanical
Omron Electronic Components BV has launched a sealed, snap-action switch with one of the smallest sizes on the market. It features an extra-long travel of 1.4 mm and is implemented without an added internal mechanism, ensuring reliable and consistent on/off operation.
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- Category: Other Components
Molex Incorporated announces that its Stac64™ stackable connection system has now been validated to the most demanding specifications of key automotive original equipment manufacturers in Germany, France, and Japan. In addition, new patents have been granted for the Stac64 design.
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- Category: Other Equipment
As part of its broad range of advanced motion controls and micropositioning mechanics, Aerotech manufactures a wide selection of rotary tables that provide training angular positioning performance for numerous industrial and scientific research and production testing applications.
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