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- Category: Test and Measurement Equipment
SIGLENT introduces the SDG3000X series arbitrary waveform generator. Designed for high fidelity and accuracy, the SDG3000X offers an output frequency of up to 200 MHz, 16-bit vertical resolution, a maximum sampling rate of 1.2 GSa/s, and up to 40 Mpts of arbitrary waveform memory per channel.
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- Category: Current Affairs
Siemens Digital Industries Software has announced multiple new collaborations with TSMC, including product certifications and innovative design solution enablement initiatives for the newest and most advanced foundry process technologies.
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- Category: Current Affairs
At Huawei's Global Power Summit held during HUAWEI CONNECT 2025, Huawei released the Global Digitalization and Intelligence Index (GDII) Report for the power sector. This report aims to provide quantitative assessment tools and strategic guidance for building future power systems for global power companies as they digitize.
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- Category: Integrated Circuits
Nordic Semiconductor has announced the launch of the nRF54LM20A, the latest addition to its nRF54L series of next-generation, ultra-low-power wireless SoCs. Based on Nordic's innovative 22nm technology platform, the nRF54L series simplifies design challenges while enabling reliable communication, extended battery life, and compact product designs.
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- Category: Seminars
Roser Electronics, Inc. announces the publication of a new e-book in collaboration with Analog Devices, Inc. (ADI) and Molex, exploring the cutting edge of miniaturization trends shaping our connected future.
In nearly every industry, engineers are being asked to come up with more compact designs for a wide variety of purposes.
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- Category: Microcontrollers
Renesas Electronics Corporation has introduced the RA8T2 microcontroller (MCU) family for high-end motor control. It is based on a 1 GHz Arm® Cortex®-M85 processor with an optional 250 MHz Arm® Cortex®-M33 processor.
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- Category: Current Affairs
ROHM and Infineon Technologies AG have signed a memorandum of understanding to collaborate on silicon carbide (SiC) power semiconductor packages used in applications such as embedded chargers, photovoltaics, energy storage systems and AI data centers.
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- Category: Technology
Emerson today announced the signing of an agreement with Vrije Universiteit Brussel (VUB) to advance broadband characterization methods for active electronically scanned array (AESA) systems.
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- Category: Current Affairs
Mr. Tim Kruse, from the Department of Mechanical and Electrical Engineering at the University of Southern Denmark, was awarded the EPCIA Student Award at the 5th Passive Components Symposium (PCNS), held on September 12, 2025 in Seville, Spain, for his outstanding doctoral thesis work.
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- Category: Current Affairs
Mouser Electronics, Inc. announces a global distribution agreement with Quantic Evans, a supplier of high-energy-density capacitors for critical applications. Quantic Evans' hybrid capacitors, known as EVANSCAPS, are used in a variety of markets, including aerospace, energy, and communications.
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- Category: Thermal control
As semiconductor packaging advances toward 2.5D and 3D architectures, managing thermal resistance at the interface becomes critical. With localized power densities exceeding 600 W/cm² for advanced semiconductors, traditional thermal interface materials are no longer sufficient.
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- Category: Variable Frequency Drives
In the field of industrial control, frequency converters—also known as variable frequency drives—are fundamental systems for the efficient control of alternating current (AC) motors. These systems combine power electronics and digital electronics techniques to transform the voltage and frequency of the electrical grid in order to regulate the speed and torque of the motors.
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