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- Category: Seminars
Mouser Electronics, Inc. provides electronic design engineers with the latest expertise in sensor technology. The evolution of semiconductors and microelectromechanical systems (MEMS) toward smaller, more affordable, and more reliable components has been a key driver of modern technology.
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- Category: Other Equipment
The telecommunications, internet, and automotive sectors are driving a shift toward larger, heavier, and more complex components, posing new challenges for electronics manufacturers.
In telecommunications infrastructure and data centers,
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- Category: Sensors
With the Visionary AI-Assist, SICK presents an AI-based sensor solution that enables collision avoidance and outdoor environmental monitoring, combined with people detection. The sensor solution integrates 2D and 3D image processing. It reliably detects people and objects and determines their distance from the sensor.
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- Category: Sensors
Mouser now has the Bosch BHI385 intelligent inertial measurement unit (IMU) in stock. The BHI385 is an intelligent sensor system that offers precise acceleration measurement up to ±28 g, enabling accurate motion analysis for high-impact events in sports, fitness, and gaming.
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- Category: Integrated Circuits
Accurate temperature measurement across four channels is paramount for applications in production lines ranging from the chemical and food processing industries, manufacturing process control, medical and climate control equipment to refrigerated, cryogenic and other environments that demand close monitoring.
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- Category: Current Affairs
Kontron AG and Exein have announced a strategic alliance that will integrate Exein's cutting-edge cybersecurity technology into Kontron's advanced solutions.
Thanks to this collaboration, Exein's technology becomes a standard security feature of KontronOS
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- Category: Assets
LEMO introduces the OPTIMA D series, a compact and rugged connector platform designed to deliver optimal performance in the most demanding environments. The new series is designed for defense, aerospace, and mission-critical systems, combining miniaturized form factors with military-grade reliability.
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- Category: UPS and Rectifiers
FEAS GmbH expands its SSE30 series of DC UPS with the 60V SSE6030 variant, offering for the first time a comprehensive supercapacitor solution for 24V, 48V, and 60V industrial systems. The new module enables uninterrupted power supply in demanding DC applications, from automation technology to telecommunications infrastructure.
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- Category: Integrated Circuits
Melexis introduces the MLX81339, a new integrated motor controller with a PWM/serial interface. This integrated circuit (IC) is designed for the compact control of three-phase BLDC motors and stepper motors up to 40 W in industrial applications such as fans, pumps, and positioning systems. Its programmable flash memory allows for complete application customization.
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- Category: Current Affairs
New statistics from World Robotics 2025 on industrial robots show that 542,076 robots were installed in 2024, more than double the number from 10 years ago. Annual installations exceeded 500,000 units for the fourth consecutive year. Asia accounted for 74% of new installations in 2024, compared to 16% for Europe and 9% for the Americas.
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- Category: Current Affairs
The EU automotive industry installed 30,650 industrial robots in 2024. This represents a year-on-year decrease of 5%. Six of the top ten vehicle-producing countries in the EU recorded double-digit losses. This is according to the World Robotics 2025 Industrial Robots report, presented by the International Federation of Robotics (IFR).
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- Category: Current Affairs
Siemens Digital Industries Software has announced a collaboration with Advanced Semiconductor Engineering, Inc. (ASE) to develop 3Dblox-based workflows for the ASE VIPack™ platform using Siemens' Innovator3D IC™ solution, which is fully certified to the 3Dblox standard.
Siemens and ASE have collaborated to validate 3Dblox workflows for three VIPack technologies, including Fanout Chip-on-Substrate (FOCoS), Fanout Chip-on-Substrate-Bridge (FOCoS-Bridge), and 2.5D and 3D ICs based on Through Silicon Via (TSV).
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