Ordinary customers can now take advantage of these advances, which include substantial innovations in artificial intelligence (AI), 3D integrated circuit design, and advanced packaging, to develop attractive and highly differentiated new products.
New collaborations and updates to technology enablement readiness include:
The AI-focused collaboration with TSMC successfully evaluated improvements in design rule checking (DRC) productivity using Calibre® Vision AI software. This AI-driven initiative to analyze and prioritize DRC violations demonstrated clear improvements in debugging efficiency, and the results were jointly validated.
The Calibre® nmPlatform software suite is certified for TSMC's advanced processes: the Calibre nmDRC, Calibre nmLVS, Calibre PERC™ and Calibre xACT programs are certified for TSMC's advanced N3C, N2P and A16TM process technologies, allowing regular customers to continue accessing Siemens' industry-leading approval technology.
Siemens and TSMC have partnered to certify Siemens' Solido Simulation Suite software for SPICE accuracy across TSMC's N3C, N2P, and A16 process technologies. This enables customers to reliably create and verify analog, mixed-signal, RF, standard cell, and memory designs using advanced TSMC nodes. This collaboration extends to TSMC's Custom Design Reference Flow (CDRF) for its A16 process, as Siemens' Solido Simulation Suite supports Reliability Aware Simulation technology, which addresses IC aging, real-time self-heating, and Safe Operating Area (SOA) checks. Furthermore, TSMC's CDRF for its A16 process incorporates Siemens' Solido Design Environment software for advanced variation-aware verification, improving design sensitivity and enabling automated cell optimization.
Siemens is collaborating with TSMC to certify its Aprisa™ software for TSMC's N2P process. The implementation flow has been validated to meet N2P requirements for chip placement, routing, finishing, and engineering change orders (ECOs), with ongoing efforts focused on optimizing performance, power, and area (PPA). This work aims to help customers accelerate design closure and achieve better results in their next-generation designs.
Siemens and TSMC have achieved significant milestones for 3D integrated circuits and enabled the design flow for TSMC Compact Universal Photonic Engine (TSMC-COUPE™) technology. Siemens' Calibre® 3DSTACK Advanced software is now certified for specific physical verification solutions, while the Calibre® 3DThermal software is now certified for static thermal analysis of designs based on TSMC 3DFabric® technologies. Siemens' Calibre 3DThermal software combines the advantages of Calibre technology for detailed chip-level analysis with the thermal analysis capabilities of Siemens' Simcenter™ Flotherm™ software, providing visibility into thermal impacts throughout the design flow and ecosystem. Furthermore, Siemens tools have been enabled to assist customers in designing using TSMC-COUPE™ technology. The companies' joint activity in the field of silicon photonics includes the development of flows using Siemens' Innovator3D IC™ software, Calibre 3DSTACK software, L-Edit software, Solido Simulation Suite software, Calibre xACT™ software, and Calibre Interactive software for the design, implementation, and verification of TSMC's COUPE technology. Innovator3D IC is enabled to support the 3Dblox language format at all levels of abstraction, and Siemens is working to obtain certification for other advanced requirements as 3Dblox continues its transition to becoming an IEEE standard.
