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- Category: Current Affairs
Eclipse Foundation and OWASP (Open Worldwide Application Security Project), a global non-profit foundation dedicated to improving software security, have announced a Memorandum of Understanding (MoU) aimed at enhancing the security of open software and supporting industry efforts to prepare for the entry into force of the European Union's Cyber Resilience Act (CRA).
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- Category: Design
Siemens, in collaboration with Arizona State University (ASU), has announced a new online microcredential program on printed circuit board (PCB) design — "PCB Design Fundamentals: From Discovery to Production" — that offers students a direct pathway to a set of highly sought-after skills in the electronics industry.
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- Category: Sensors
Danisense announces its new high-precision DP12IP current transducer, designed for isolated DC and AC current measurement in demanding printed circuit board-mounted power electronics applications.
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- Category: Embedded Systems
The Lattice Semiconductor CrossLinkU-NX System-on-Module (SoM) board is based on the CrossLinkU™-NX LIFCL-33U FPGA, optimized for resource-constrained edge AI applications. This SoM board provides direct access to the CSI-2 camera input, USB 3.1 device interface, digital I/O, and Always-On (AON) functionality.
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- Category: Embedded Systems
The Iono Pi v3 is compatible with Raspberry Pi 4B and Raspberry Pi 5—in memory configurations from 1GB to 16GB—with full connectivity: Gigabit Ethernet, Wi-Fi, Bluetooth/BLE, four USB ports, and a microSD card slot. Any compatible operating system and software will run without modification: Linux, Node-RED, CODESYS, Python, or custom applications.
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- Category: Liabilities
With the new 1090HL size (HL = High Leakage), Würth Elektronik expands its WE-MCRI product series with a coupled inductor, which has been specifically developed to increase the performance of SEPIC, ZETA and Ćuk converters.
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- Category: Integrated Circuits
Renesas Electronics Corporation has announced its third-generation (Gen 3) chipset solutions for DDR5 Multiplexed Rank Dual In-Line (MRDIMM) memory modules, delivering server-class DDR5 MRDIMM speeds of up to 16,000 megatransfers per second (MT/s). The new solutions are designed to meet the growing demand for higher memory bandwidth driven by artificial intelligence (AI) data centers, cloud infrastructure, and accelerated computing workloads.
As AI models grow larger and computing workloads demand greater volumes of data, system architects face increasing challenges in delivering higher memory bandwidth without sacrificing compatibility with existing server platforms. Renesas' third-generation MRDIMM solutions offer 25% higher memory bandwidth than their second-generation solutions while still utilizing existing DDR5 infrastructure. As a result, server platforms can achieve higher performance without disruptive architectural changes.
Renesas continues to offer a field-proven, production-ready MRDIMM platform encompassing MRCDs, MDBs, power management integrated circuits (PMICs), serial presence detection concentrators (SPDs), and temperature sensors. This platform approach enables customers to scale MRDIMM performance across generations while maintaining design continuity and accelerating deployment.
MRDIMM Gen 3 builds upon the proven MRDIMM architecture introduced with Gen 2, expanding performance while maintaining standard DIMM form factors and system compatibility. Gen 3 also introduces improvements in system visibility and robustness, including a quality indication status for the Device Equalization Self-Training Mode (DESTM), which allows users to fine-tune receiver timing and EQ training to maximize headroom.
In addition to performance improvements, Renesas' Gen 3 MRDIMM solutions have been designed with system-level energy efficiency in mind, helping customers balance increasing bandwidth requirements with system-level thermal and power consumption constraints. Detailed power consumption comparisons will be provided in the accompanying product documentation.
“AMD has a long history of supporting open, standards-based technologies that drive innovation in data centers and provide greater flexibility as AI and HPC workloads continue to evolve,” said Amit Goel, corporate vice president of Enterprise AI and Compute Platform Solutions Engineering at AMD. “Innovations in next-generation memory formats, such as MRDIMM and the Renesas chipset, are important in helping the industry deliver higher bandwidth, greater efficiency, and continuous platform scalability.”
“AI training and inference workloads are fundamentally redefining system memory requirements for data center infrastructure,” said Sameer Kuppahalli, vice president and general manager of the Memory Interfaces Division at Renesas. “To meet the insatiable demands of these workloads for memory capacity and performance, Renesas continues to lead the industry with the launch of our 3rd generation of chipset components for MRDIMMs.” Our customers use the full suite of Renesas chipset components to continue pushing the boundaries of memory performance and capacity."
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- Category: Liabilities
KIOXIA Europe GmbH has announced its UFS(1) 5.0 embedded flash memory solutions, designed to deliver the performance, efficiency, and capacity required for the next generation of AI-powered mobile devices and peripherals.
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- Category: Integrated Circuits
Mouser Electronics, Inc. now has the STMicroelectronics ASM330LHHG1 6-axis inertial measurement unit (IMU) in stock. The ASM330LHHG1 sensor features a 3-axis digital gyroscope and a 3-axis digital accelerometer, and operates over an extended temperature range of -40 to +125 °C.
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- Category: Industrial Computing
Moxa Inc. announces the launch of the power industry's first fanless server compliant with IEC 61850-3: the DA-920E series. These next-generation, substation-ready fanless servers are designed to provide a reliable computing platform for substation Virtual Protection, Automation, and Control (vPAC) frameworks
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- Category: Current Affairs
element14, an Avnet community, has launched a new smart home and healthcare design challenge that invites engineers, makers, and technology enthusiasts to design and build innovative prototypes focused on improving everyday environments and personal well-being.
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- Category: Seminars
ROHM Co., Ltd. announces the launch of the English version of Engineer Social Hub, an online platform designed to provide engineers with easy access to technical information, practical knowledge, and support from ROHM. Engineer Social Hub brings together ROHM's technical content related to semiconductor products and solutions in one place.
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