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- Category: Sensors
Powell Electronics offers Honeywell's GAPS (General Aerospace Proximity Sensors) and HAPS (Harsh Application Proximity Sensors) proximity sensors. Both sensor series incorporate Honeywell's patented integrated condition monitoring functionality
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- Category: Technology
The Eurecat technology center is participating in the TECSOL-FRUT project, which was created with the aim of responding to two of the main challenges facing the agricultural sector: adapting crops to climate change and the need to move towards a more sustainable and decarbonized energy model.
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- Category: Liabilities
As AI infrastructure, industrial robotics, battery management systems (BMS), and advanced power electronics drive ever-increasing requirements for power density and efficiency, accurate current measurement is becoming increasingly important.
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- Category: Sensors
Hottinger Brüel & Kjær (HBK) has expanded the interface options available for its WI and WA series of inductive displacement sensors, introducing models with an IO-Link interface in addition to the existing industrial interface options. These sensors have long been successfully used in monitoring, quality control, production, and assembly applications, as well as in civil engineering.
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- Category: Integrated Circuits
Mouser Electronics, Inc. offers MediaTek's Genio 420 IoT platform, a solution designed for embedded devices that need to combine processing power, connectivity, and artificial intelligence (AI) and generative AI (GenAI) capabilities directly on the device. The Genio 420 is geared toward edge computing applications, where running inference locally reduces latency and decreases reliance on cloud processing services.
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- Category: Microcontrollers
Toshiba Electronics Europe GmbH has announced the start of series production of the TXZ+™ Entry-Class M4L Group family, a new series of Arm® Cortex®-M4-based microcontrollers with a floating-point unit (FPU) operating at up to 80 MHz. The devices are available with 128 KB or 256 KB of flash code memory in four compact package options.
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- Category: Embedded Systems
The evolution towards compact, high-performance edge AI systems is redefining sensor connectivity, which in turn forces developers to provide space-efficient architectures that remain secure, scalable, and future-proof.
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- Category: Current Affairs
BIWIN Semiconductor (HK) Company Limited (“BIWIN”) and TERA INDÚSTRIA DE SEMICONDUTORES SA (“Tera”), a Brazilian semiconductor memory packaging company, announce the signing of a strategic collaboration framework agreement for the manufacturing and distribution of memory and storage solutions in Brazil. The alliance establishes a comprehensive collaboration encompassing equipment supply, technical exchange, and industrial cooperation.
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- Category: Current Affairs
The European Semiconductor Industry Association (ESIA) has announced that the strong momentum in global semiconductor sales will continue into the second quarter of 2026, with global sales increasing by 123.6% in the second quarter of 2026 compared to the second quarter of 2025 (i.e., year-on-year), reaching $403.3 billion.
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- Category: Design
The DC/DC converter design tool is REDEXPERT's most widely used calculation tool. Würth Elektronik has updated this online service. The core element of the new tool is a proprietary, high-precision loss calculation algorithm for inductors, based on the actual characterization of the components.
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- Category: Test and Measurement Equipment
Pickering Interfaces has introduced the 60-191 family of high-current, sensing SPST LXI switches. This new family, the company's highest-current switching product range to date, enables switching of signals up to 80 A and 300 V, while simplifying the distribution, sequencing, and management of multiple high-current power supplies in automated test systems.
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- Category: Electromechanical
Yamaichi Electronics expands its proven T-series range of metal push-pull circular connectors with a new 90° (WE) PCB socket. This right-angle PCB solution is designed for applications requiring a space-saving design, high reliability, and easy PCB integration.
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