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- Category: Other Components
Teledyne FLIR, part of Teledyne Technologies Incorporated, has announced the Lepton 3.1R, the world’s first radiometric thermal camera module with a 95-degree field of view, 160 x 120 resolution, and a scene dynamic range of up to 400°C. The 3.1R retains the same compact, low-power form factor as the Lepton family of thermal camera modules.
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- Category: Liabilities
Cinch Connectivity Solutions, a Bel Group company, has announced the launch of the Johnson mmWave RF connector family, featuring 30-degree right-angle connectors in four sizes: SMA, 2.92 mm, 2.4 mm, and 1.85 mm. Johnson's coaxial RF connectors are designed for use in a variety of applications and markets, offering high-frequency performance from DC to 67 GHz, while delivering superior signal integrity in the most demanding environments.
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- Category: Current Affairs
According to DMASS Europe eV, the distribution of European components is experiencing the expected slowdown in an overheated market. While semiconductors still grew by 19.3% in the second quarter, reaching €3.91 billion, IP&E components (Interconnect, Passive, and Electromechanical) already saw a 7.3% decrease, falling to €1.56 billion. The total distribution market grew by 10.3% to €5.47 billion.
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- Category: Embedded Systems
Farnell announces the addition of the Arduino Pro Portenta C33 System-on-Module (SOM) to its portfolio. This cost-effective, high-performance, and massive platform provides an accelerated path to IoT automation, complete with industrial-grade quality and guaranteed safety.
The Portenta C33 delivers the high performance the Portenta family is known for at a lower starting price.
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- Category: Technology
Today, scarce metals and unsustainable materials are used in the manufacture of conductive circuits for electronic devices. With the aim of helping to reduce dependence on these finite resources, the REFORM project will develop electronic components using naturally sourced adhesives, conductive inks, and flexible substrates.
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- Category: Technology
Mouser Electronics Inc. launches its latest installment in the Empowering Innovation Together (EIT) series, revealing the transformative potential of digital therapies. Mouser explores the link between technology and medical devices to discover how these components can work together to deliver more personalized and accessible healthcare.
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- Category: Embedded Systems
Würth Elektronik and STMicroelectronics have jointly developed a demo using a Würth Group drill. The reference design for the efficient control of a low-voltage brushless DC motor is ideal for portable power tool applications. The design includes all the necessary user interfaces for controlling motor activation, speed, and direction.
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- Category: Embedded Systems
Panasonic Industry has recently announced contacts with Finnish mesh firmware innovators Wirepas to integrate their proprietary advanced mesh connectivity into the PAN1780, a Bluetooth® 5 Low Energy module based on Nordic Semiconductor's nRF52840 single-chip controller.
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- Category: Microcontrollers
Mecter introduces Holtek's new dedicated wireless communication MCU, the HT32F67233, an Arm® Cortex®-M0+ core Sub-1GHz OOK/GFSK transceiver. Operating in the unlicensed ISM bands of 315/433/470/868/915 MHz with voltages from 2.0 V to 3.6 V, it is suitable for very low power bidirectional wireless transmission applications such as industrial control (meters and data logging), smart home appliances (security products, sensors, and alarm systems), remote control, industrial/agricultural automation, data acquisition and logging, and more.
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- Category: Current Affairs
Ficosa has submitted a total of 23 projects to the second call for proposals for the PERTE program for Electric and Connected Vehicles (EVs) and for microelectronics and semiconductors, promoted by the Spanish Government. These applications share the common goal of promoting the development of electric and connected vehicles and positioning Spain as a leader within the European sustainable mobility ecosystem.
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- Category: Liabilities
Harwin announces that its Kona high-power connector series now features back covers. These back covers, made from aerospace-grade 6061 aluminum alloy, prevent electromagnetic interference (EMI) from escaping the connector/wiring into the surrounding environment.
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- Category: Other Semiconductors
Toshiba Electronics Europe GmbH ("Toshiba") has launched a 12V common-drain N-channel MOSFET with a current rating of 20A, for use in battery protection circuits in lithium-ion (Li-ion) battery packs, such as those commonly used in smartphones, tablets, power banks, compact digital cameras, digital SLR cameras, and other similar applications.
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